Inventor

LIN YING-MEI

TW2 patents

Patents

2 patents

US9132523B2Sep 15, 2015

Chemical mechanical polish process control for improvement in within-wafer thickness uniformity

LEE SHEN-NAN5 citations69

US8129279B2Mar 6, 2012

Chemical mechanical polish process control for improvement in within-wafer thickness uniformity

LEE SHEN-NAN4 citations59