Inventor

CHENG YU-JEN

TW24 patents

⚠️ This page may combine multiple inventors who share the name “CHENG YU-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHENG YU-JEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package and manufacturing method thereof

Semiconductor die package and method of manufacture

Semiconductor die package and method of manufacture

Fingerprint sensor pixel array and methods of forming same

Fingerprint sensor device and method

Fingerprint sensor pixel array and methods of forming same

Fingerprint sensor pixel array and methods of forming same

Fingerprint sensor device and method

Integrated circuit package and method of forming same

Semiconductor device

Fingerprint sensor device and method

Fingerprint sensor device and method

Fingerprint sensor device and method

Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die

Fingerprint sensor pixel array and methods of forming same

Integrated circuit package and method of forming same

LEE SHEN-NAN

Chemical mechanical polish process control for improvement in within-wafer thickness uniformity

Chemical mechanical polish process control for improvement in within-wafer thickness uniformity

WANG BILY

Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency

HSU CHIH-WEI

Advanced process control for new tapeout product

LEXTAR ELECTRONICS CORP

Package structure of light-emitting element

WANG CHIEN RHONE

Apparatus and methods for end point determination in reactive ion etching

RICHTEK TECHNOLOGY CORP

Interface control circuit and control method thereof

(unassigned)

Switch structure for a heating device