P

Inventor

GRINMAN ANDREY

IL11 patents
⚠️ This page may combine multiple inventors who share the name “GRINMAN ANDREY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TESSERA INC

3 patents
US7791199B2Sep 7, 2010

Packaged semiconductor chips

TESSERA INC49 citations97
US9548254B2Jan 17, 2017

Packaged semiconductor chips with array

TESSERA INC2 citations72
US9070678B2Jun 30, 2015

Packaged semiconductor chips with array

TESSERA INC0 citations51

GRINMAN ANDREY

3 patents
US8653644B2Feb 18, 2014

Packaged semiconductor chips with array

GRINMAN ANDREY4 citations81
US8704347B2Apr 22, 2014

Packaged semiconductor chips

GRINMAN ANDREY0 citations49
US8569876B2Oct 29, 2013

Packaged semiconductor chips with array

GRINMAN ANDREY0 citations49

FLIR SYSTEMS

2 patents
US11063159B2Jul 13, 2021

Methods for routing electrical interconnections and resultant structures

FLIR SYSTEMS1 citations60
US10818550B2Oct 27, 2020

Methods for singulation and packaging

FLIR SYSTEMS1 citations60

TESSERA TECH IRELAND LTD

1 patent
US7936062B2May 3, 2011

Wafer level chip packaging

TESSERA TECH IRELAND LTD75 citations94

TESSERA TECH HUNGARY KFT

1 patent
US7807508B2Oct 5, 2010

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

TESSERA TECH HUNGARY KFT62 citations94

AVSIAN OSHER

1 patent
US8551815B2Oct 8, 2013

Stack packages using reconstituted wafers

AVSIAN OSHER21 citations87