P

Inventor

ROSENSTEIN CHARLES

IL10 patents
⚠️ This page may combine multiple inventors who share the name “ROSENSTEIN CHARLES”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TESSERA INC

4 patents
US7791199B2Sep 7, 2010

Packaged semiconductor chips

TESSERA INC49 citations97
US9548254B2Jan 17, 2017

Packaged semiconductor chips with array

TESSERA INC2 citations72
US9070678B2Jun 30, 2015

Packaged semiconductor chips with array

TESSERA INC0 citations51
US8053281B2Nov 8, 2011

Method of forming a wafer level package

TESSERA INC1 citations51

GRINMAN ANDREY

3 patents
US8653644B2Feb 18, 2014

Packaged semiconductor chips with array

GRINMAN ANDREY4 citations81
US8704347B2Apr 22, 2014

Packaged semiconductor chips

GRINMAN ANDREY0 citations49
US8569876B2Oct 29, 2013

Packaged semiconductor chips with array

GRINMAN ANDREY0 citations49

TESSERA TECH IRELAND LTD

2 patents
US7935568B2May 3, 2011

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

TESSERA TECH IRELAND LTD74 citations97
US7936062B2May 3, 2011

Wafer level chip packaging

TESSERA TECH IRELAND LTD75 citations94

TESSERA TECH HUNGARY KFT

1 patent
US7807508B2Oct 5, 2010

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

TESSERA TECH HUNGARY KFT62 citations94