Inventor
YU TA-JEN
TW29 patents
⚠️ This page may combine multiple inventors who share the name “YU TA-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
28 patentsUS10573616B2Feb 25, 2020
Semiconductor package and method for fabricating base for semiconductor package
MEDIATEK INC4 citations84
US10553526B2Feb 4, 2020
Semiconductor package
MEDIATEK INC5 citations84
US9922844B2Mar 20, 2018
Semiconductor package and method for fabricating base for semiconductor package
MEDIATEK INC5 citations84
US9177899B2Nov 3, 2015
Semiconductor package and method for fabricating base for semiconductor package
MEDIATEK INC9 citations84
US10217716B2Feb 26, 2019
Semiconductor package and method for fabricating the same
MEDIATEK INC8 citations79
US11450606B2Sep 20, 2022
Chip scale package structure and method of forming the same
MEDIATEK INC3 citations73
US10756040B2Aug 25, 2020
Semiconductor package with rigid under bump metallurgy (UBM) stack
MEDIATEK INC4 citations73
US10580747B2Mar 3, 2020
Semiconductor package and method for fabricating base for semiconductor package
MEDIATEK INC2 citations73
US10573615B2Feb 25, 2020
Semiconductor package and method for fabricating base for semiconductor package
MEDIATEK INC2 citations73
US10573536B2Feb 25, 2020
Semiconductor package and method for fabricating base for semiconductor package
MEDIATEK INC2 citations73
US10236187B2Mar 19, 2019
Semiconductor package and method for fabricating base for semiconductor package
MEDIATEK INC3 citations73
US10115604B2Oct 30, 2018
Semiconductor package and method for fabricating base for semiconductor package
MEDIATEK INC2 citations73
US9553040B2Jan 24, 2017
Semiconductor package
MEDIATEK INC3 citations73
US9627311B2Apr 18, 2017
Chip package, package substrate and manufacturing method thereof
MEDIATEK INC1 citations63
US9520349B2Dec 13, 2016
Semiconductor package
MEDIATEK INC2 citations63
US11791266B2Oct 17, 2023
Chip scale package structure and method of forming the same
MEDIATEK INC0 citations62
US11469201B2Oct 11, 2022
Semiconductor package and method for fabricating base for semiconductor package
MEDIATEK INC0 citations62
US10916449B2Feb 9, 2021
Semiconductor package and method for fabricating base for semiconductor package
MEDIATEK INC0 citations62
US9437457B2Sep 6, 2016
Chip package having a patterned conducting plate and method for forming the same
MEDIATEK INC2 citations62
US11854784B2Dec 26, 2023
Chip scale package structure and method of forming the same
MEDIATEK INC0 citations52
US10340198B2Jul 2, 2019
Semiconductor package with embedded supporter and method for fabricating the same
MEDIATEK INC0 citations52
US10236242B2Mar 19, 2019
Chip package and package substrate
MEDIATEK INC0 citations52
US9852973B2Dec 26, 2017
Manufacturing method of chip package and package substrate
MEDIATEK INC0 citations52
US9633936B2Apr 25, 2017
Semiconductor package
MEDIATEK INC0 citations52
US10312210B2Jun 4, 2019
Semiconductor package
MEDIATEK INC0 citations51
US10074581B2Sep 11, 2018
Chip package having a patterned conducting plate and a conducting pad with a recess
MEDIATEK INC0 citations51
US9972593B2May 15, 2018
Semiconductor package
MEDIATEK INC1 citations51
US9373526B2Jun 21, 2016
Chip package and method for forming the same
MEDIATEK INC0 citations51