Inventor
LEE MENG-TSAN
TW16 patents
Patents
16 patentsUS10163802B2Dec 25, 2018
Fan-out package having a main die and a dummy die, and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD76 citations97
US10510674B2Dec 17, 2019
Fan-out package having a main die and a dummy die, and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD20 citations94
US9972581B1May 15, 2018
Routing design of dummy metal cap and redistribution line
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations92
US11094641B2Aug 17, 2021
Fan-out package having a main die and a dummy die
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10354961B2Jul 16, 2019
Routing design of dummy metal cap and redistribution line
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US11967563B2Apr 23, 2024
Fan-out package having a main die and a dummy die
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11581268B2Feb 14, 2023
Semiconductor package with redistribution structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11031352B2Jun 8, 2021
Routing design of dummy metal cap and redistribution line
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US12550783B2Feb 10, 2026
Device and method for UBM/RDL routing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12550737B2Feb 10, 2026
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12506087B2Dec 23, 2025
Semiconductor package with redistribution structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12394754B2Aug 19, 2025
Device and method for UBM/RDL routing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322727B2Jun 3, 2025
Device and method for UBM/RDL routing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12224247B2Feb 11, 2025
Fan-out package having a main die and a dummy die
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11955439B2Apr 9, 2024
Semiconductor package with redistribution structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11195802B2Dec 7, 2021
Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62