Inventor

CHIU CHIEN-CHIA

TW22 patents

⚠️ This page may combine multiple inventors who share the name “CHIU CHIEN-CHIA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIU CHIEN-CHIA

TAIWAN SEMICONDUCTOR MFG CO LTD

Routing design of dummy metal cap and redistribution line

Routing design of dummy metal cap and redistribution line

Semiconductor package with redistribution structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Post-passivation interconnect structure and methods thereof

Routing design of dummy metal cap and redistribution line

Semiconductor package with stiffener structure and method of manufacturing the same

Semiconductor package and method

Semiconductor package with redistribution structure and manufacturing method thereof

Semiconductor device

Semiconductor package and manufacturing method thereof

Semiconductor package with stiffener structure and method forming the same

Semiconductor package with redistribution structure and manufacturing method thereof

Semiconductor package with stiffener structure

Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof

Semiconductor device

Post-passivation interconnect structure and methods thereof

Shadow pad for post-passivation interconnect structures

Conductive pattern and integrated fan-out package having the same

IND TECH RES INST

High efficiency white light emitting diode

Semiconductor laser structure with an increased catastrophic optical damage level

YU CHEN-HUA

Interposer wafer bonding method and apparatus