Inventor
DRAB JOHN J
US36 patents
⚠️ This page may combine multiple inventors who share the name “DRAB JOHN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
33 patentsUS6101102AAug 8, 2000
Fixed frequency regulation circuit employing a voltage variable dielectric capacitor
RAYTHEON CO199 citations98
US5966318AOct 12, 1999
Nondestructive readout memory utilizing ferroelectric capacitors isolated from bitlines by buffer amplifiers
RAYTHEON CO24 citations92
US6803794B2Oct 12, 2004
Differential capacitance sense amplifier
RAYTHEON CO38 citations91
US9887195B1Feb 6, 2018
Coaxial connector feed-through for multi-level interconnected semiconductor wafers
RAYTHEON CO9 citations82
US7675066B1Mar 9, 2010
Erase-on-demand memory cell
RAYTHEON CO10 citations77
US5804823ASep 8, 1998
Bismuth layered structure pyroelectric detectors
RAYTHEON CO11 citations74
US6303804B1Oct 16, 2001
Environmentally benign bismuth-containing spin-on precursor materials
RAYTHEON CO11 citations73
US6054600AApr 25, 2000
Non-toxic solvent soluble group IV and V metal acid salt complexes using polyether acid anhydrides
RAYTHEON CO11 citations73
US10242967B2Mar 26, 2019
Die encapsulation in oxide bonded wafer stack
RAYTHEON CO4 citations72
US7273942B1Sep 25, 2007
Water-soluble group III polyether acid salt complexes and thin films from same
RAYTHEON CO7 citations72
US6316651B1Nov 13, 2001
Environmentally benign Group II and Group IV or V spin-on precursor materials
RAYTHEON CO7 citations72
US10541461B2Jan 21, 2020
Tile for an active electronically scanned array (AESA)
RAYTHEON CO6 citations71
US10354975B2Jul 16, 2019
Barrier layer for interconnects in 3D integrated device
RAYTHEON CO5 citations68
US11177155B2Nov 16, 2021
Direct bond method providing thermal expansion matched devices
RAYTHEON CO0 citations62
US10971538B2Apr 6, 2021
PiN diode structure having surface charge suppression
RAYTHEON CO0 citations62
US10128297B2Nov 13, 2018
Pin diode structure having surface charge suppression
RAYTHEON CO1 citations62
US9224768B2Dec 29, 2015
Pin diode structure having surface charge suppression
RAYTHEON CO2 citations62
US8053251B2Nov 8, 2011
Temperature-compensated ferroelectric capacitor device, and its fabrication
RAYTHEON CO5 citations61
US11659660B2May 23, 2023
Oxide liner stress buffer
RAYTHEON CO0 citations60
US6045030AApr 4, 2000
Sealing electronic packages containing bumped hybrids
RAYTHEON CO2 citations60
US12354911B2Jul 8, 2025
Cu3Sn via metallization in electrical devices for low-temperature 3D-integration
RAYTHEON CO0 citations59
US11854879B2Dec 26, 2023
Cu3Sn via metallization in electrical devices for low-temperature 3D-integration
RAYTHEON CO0 citations59
US7683854B2Mar 23, 2010
Tunable impedance surface and method for fabricating a tunable impedance surface
RAYTHEON CO3 citations58
US11387916B1Jul 12, 2022
Three-dimensional wafer-stacked optical and radio frequency phased array transceiver system
RAYTHEON CO0 citations56
US10453731B2Oct 22, 2019
Direct bond method providing thermal expansion matched devices
RAYTHEON CO0 citations52
US6984745B2Jan 10, 2006
Environmentally benign lead zirconate titanate ceramic precursor materials
RAYTHEON CO0 citations52
US10784234B2Sep 22, 2020
Die encapsulation in oxide bonded wafer stack
RAYTHEON CO0 citations51
US7635761B2Dec 22, 2009
Water-soluble group III polyether acid salt complexes and thin films from same
RAYTHEON CO0 citations51
US10679888B2Jun 9, 2020
Foundry-agnostic post-processing method for a wafer
RAYTHEON CO0 citations50
US10354910B2Jul 16, 2019
Foundry-agnostic post-processing method for a wafer
RAYTHEON CO0 citations50
US7545625B2Jun 9, 2009
Electrode for thin film capacitor devices
RAYTHEON CO0 citations47
US7335552B2Feb 26, 2008
Electrode for thin film capacitor devices
RAYTHEON CO0 citations47
US10418406B2Sep 17, 2019
Hybrid sensor chip assembly and method for reducing radiative transfer between a detector and read-out integrated circuit
RAYTHEON CO0 citations45