Inventor
CHUANG CHUN-CHIEH
TW84 patents
⚠️ This page may combine multiple inventors who share the name “CHUANG CHUN-CHIEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
26 patentsUS9728521B2Aug 8, 2017
Hybrid bond using a copper alloy for yield improvement
TAIWAN SEMICONDUCTOR MFG CO LTD227 citations98
US9704827B2Jul 11, 2017
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD32 citations98
US11596800B2Mar 7, 2023
Interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations86
US11798916B2Oct 24, 2023
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations85
US10056353B2Aug 21, 2018
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9780137B2Oct 3, 2017
Mechanisms for forming image-sensor device with epitaxial isolation feature
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9764153B2Sep 19, 2017
Interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9666630B2May 30, 2017
Semiconductor devices, methods of manufacturing thereof, and image sensor devices
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9666566B1May 30, 2017
3DIC structure and method for hybrid bonding semiconductor wafers
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US11804473B2Oct 31, 2023
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11011567B2May 18, 2021
Structure and method for 3D image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10886320B2Jan 5, 2021
Mechanisms for forming image-sensor device with epitaxial isolation feature
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10535706B2Jan 14, 2020
Interconnect structure for stacked device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10290671B2May 14, 2019
Image sensor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10276622B2Apr 30, 2019
Mechanisms for forming image-sensor device with expitaxial isolation feature
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10269770B2Apr 23, 2019
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10192918B2Jan 29, 2019
Image sensor including dual isolation and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10157959B2Dec 18, 2018
Interconnect structure for stacked device and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9865645B2Jan 9, 2018
Interconnect structure for stacked device and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9837464B2Dec 5, 2017
Backside structure and methods for BSI image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9773828B2Sep 26, 2017
Image sensor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9627430B2Apr 18, 2017
Method and apparatus for low resistance image sensor contact
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9576999B2Feb 21, 2017
Backside structure and methods for BSI image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11152414B2Oct 19, 2021
Image sensor including dual isolation and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9525003B2Dec 20, 2016
Structure and method for 3D image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12476224B2Nov 18, 2025
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
TAIWAN SEMICONDUCTOR MFG
11 patentsUS8736006B1May 27, 2014
Backside structure for a BSI image sensor device
TAIWAN SEMICONDUCTOR MFG31 citations93
US9312294B2Apr 12, 2016
Semiconductor devices, methods of manufacturing thereof, and image sensor devices
TAIWAN SEMICONDUCTOR MFG6 citations84
US9305966B2Apr 5, 2016
Backside structure and method for BSI image sensors
TAIWAN SEMICONDUCTOR MFG5 citations84
US9287312B2Mar 15, 2016
Imaging sensor structure and method
TAIWAN SEMICONDUCTOR MFG7 citations84
US8969991B2Mar 3, 2015
Backside structure and methods for BSI image sensors
TAIWAN SEMICONDUCTOR MFG8 citations84
US7968424B2Jun 28, 2011
Method of implantation
TAIWAN SEMICONDUCTOR MFG11 citations84
US9373657B2Jun 21, 2016
System and method for fabricating a 3D image sensor structure
TAIWAN SEMICONDUCTOR MFG4 citations73
US8810700B2Aug 19, 2014
Front side implanted guard ring structure for backside
TAIWAN SEMICONDUCTOR MFG4 citations73
US9245912B2Jan 26, 2016
Method and apparatus for low resistance image sensor contact
TAIWAN SEMICONDUCTOR MFG2 citations63
US9059061B2Jun 16, 2015
Structure and method for 3D image sensor
TAIWAN SEMICONDUCTOR MFG3 citations63
US8895349B2Nov 25, 2014
Backside illuminated image sensor having capacitor on pixel region
TAIWAN SEMICONDUCTOR MFG3 citations63
WANG WEN-DE
3 patentsUS9142586B2Sep 22, 2015
Pad design for backside illuminated image sensor
WANG WEN-DE37 citations97
US8531565B2Sep 10, 2013
Front side implanted guard ring structure for backside illuminated image sensor
WANG WEN-DE16 citations92
US8227288B2Jul 24, 2012
Image sensor and method of fabricating same
WANG WEN-DE7 citations83
CHUANG CHUN-CHIEH
3 patentsUS8709854B2Apr 29, 2014
Backside structure and methods for BSI image sensors
CHUANG CHUN-CHIEH14 citations92
US8981510B2Mar 17, 2015
Ridge structure for back side illuminated image sensor
CHUANG CHUN-CHIEH7 citations84
US8569807B2Oct 29, 2013
Backside illuminated image sensor having capacitor on pixel region
CHUANG CHUN-CHIEH7 citations81
CHEN SZU-YING
1 patentKAO MIN-FENG
1 patentLIU HAN-CHI
1 patentLIU JEN-CHENG
1 patentHUNG JHY-MING
1 patentCHOU KENG-YU
1 patentLIN JENG-SHYAN
1 patentShowing the top 50 of 84 patents by PatentIndex Score.