P

Inventor

CHUANG CHUN-CHIEH

TW84 patents
⚠️ This page may combine multiple inventors who share the name “CHUANG CHUN-CHIEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

26 patents
US9728521B2Aug 8, 2017

Hybrid bond using a copper alloy for yield improvement

TAIWAN SEMICONDUCTOR MFG CO LTD227 citations98
US9704827B2Jul 11, 2017

Hybrid bond pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD32 citations98
US11596800B2Mar 7, 2023

Interconnect structure and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations86
US11798916B2Oct 24, 2023

3DIC interconnect apparatus and method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations85
US10056353B2Aug 21, 2018

3DIC interconnect apparatus and method

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9780137B2Oct 3, 2017

Mechanisms for forming image-sensor device with epitaxial isolation feature

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9764153B2Sep 19, 2017

Interconnect structure and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9666630B2May 30, 2017

Semiconductor devices, methods of manufacturing thereof, and image sensor devices

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9666566B1May 30, 2017

3DIC structure and method for hybrid bonding semiconductor wafers

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US11804473B2Oct 31, 2023

Hybrid bond pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11011567B2May 18, 2021

Structure and method for 3D image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10886320B2Jan 5, 2021

Mechanisms for forming image-sensor device with epitaxial isolation feature

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10535706B2Jan 14, 2020

Interconnect structure for stacked device and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10290671B2May 14, 2019

Image sensor device and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10276622B2Apr 30, 2019

Mechanisms for forming image-sensor device with expitaxial isolation feature

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10269770B2Apr 23, 2019

Hybrid bond pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10192918B2Jan 29, 2019

Image sensor including dual isolation and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10157959B2Dec 18, 2018

Interconnect structure for stacked device and method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9865645B2Jan 9, 2018

Interconnect structure for stacked device and method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9837464B2Dec 5, 2017

Backside structure and methods for BSI image sensors

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9773828B2Sep 26, 2017

Image sensor device and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9627430B2Apr 18, 2017

Method and apparatus for low resistance image sensor contact

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9576999B2Feb 21, 2017

Backside structure and methods for BSI image sensors

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11152414B2Oct 19, 2021

Image sensor including dual isolation and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9525003B2Dec 20, 2016

Structure and method for 3D image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12476224B2Nov 18, 2025

3DIC interconnect apparatus and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

TAIWAN SEMICONDUCTOR MFG

11 patents

WANG WEN-DE

3 patents

CHUANG CHUN-CHIEH

3 patents

CHEN SZU-YING

1 patent

KAO MIN-FENG

1 patent

LIU HAN-CHI

1 patent

LIU JEN-CHENG

1 patent

HUNG JHY-MING

1 patent

CHOU KENG-YU

1 patent

LIN JENG-SHYAN

1 patent

Showing the top 50 of 84 patents by PatentIndex Score.