Inventor

HUNG FENG-CHI

TW140 patents

⚠️ This page may combine multiple inventors who share the name “HUNG FENG-CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUNG FENG-CHI

TAIWAN SEMICONDUCTOR MFG CO LTD

Hybrid bond using a copper alloy for yield improvement

Hybrid bond pad structure

Semiconductor devices having reduced noise

Mechanisms for forming image-sensor device with deep-trench isolation structure

Mechanisms for forming image-sensor device with deep-trench isolation structure

Stacked integrated circuits with redistribution lines

Interconnect structure and method of forming same

Via support structure under pad areas for BSI bondability improvement

Mechanisms for forming image-sensor device with deep-trench isolation structure

Image sensing device

Via support structure under pad areas for BSI bondability improvement

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Via support structure under pad areas for BSI bondability improvement

Mechanisms for forming image sensor device with deep-trench isolation structure

Bond pad structure for bonding improvement

Via support structure under pad areas for BSI bondability improvement

Stacked SPAD image sensor

Voltage biased metal shielding and deep trench isolation for backside illuminated (BSI) image sensors

Mechanisms for forming image-sensor device with epitaxial isolation feature

Interconnect structure and method of forming same

Semiconductor devices, methods of manufacturing thereof, and image sensor devices

Interconnect apparatus and method

Semiconductor device and manufacturing method thereof

3DIC interconnect devices and methods of forming same

Stacked integrated circuits with redistribution lines

3DIC structure and method for hybrid bonding semiconductor wafers

Composite BSI structure and method of manufacturing the same

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Image sensor

Hybrid bond pad structure

Mechanisms for forming image-sensor device with deep-trench isolation structure

Bond pad structure for bonding improvement

Composite bsi structure and method of manufacturing the same

Structure and method for 3D image sensor

Mechanisms for forming image-sensor device with epitaxial isolation feature

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Semiconductor imaging device having improved dark current performance

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Interconnect structure for stacked device and method

Semiconductor device structure and method for forming the same

Mechanisms for forming image-sensor device with expitaxial isolation feature

TAIWAN SEMICONDUCTOR MFG

Vertically integrated image sensor chips and methods for forming the same

Backside structure for a BSI image sensor device

Semiconductor devices, methods of manufacturing thereof, and image sensor devices

Imaging sensor structure and method

Varied STI liners for isolation structures in image sensing devices

Interconnect structure and method

LIN JENG-SHYAN

Image sensor device and method

CHEN SZU-YING

Method of forming an image device

CHEN U-TING

Scribe lines in wafers