Inventor
PAREDES STEPHAN
CH34 patents
⚠️ This page may combine multiple inventors who share the name “PAREDES STEPHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
24 patentsUS9416031B2Aug 16, 2016
Desalination system and method for desalination
IBM17 citations90
US11152707B1Oct 19, 2021
Fast radio frequency package
IBM14 citations82
US9630862B2Apr 25, 2017
Desalination system and method for desalination
IBM11 citations82
US9437766B2Sep 6, 2016
Photovoltaic thermal hybrid systems and method of operation thereof
IBM7 citations82
US10527365B1Jan 7, 2020
Disconnect assembly for active cooling of packaged electronics
IBM4 citations72
US10388540B2Aug 20, 2019
High-performance compliant heat-exchanger comprising vapor chamber
IBM2 citations72
US9153722B2Oct 6, 2015
Photovoltaic module cooling devices
IBM5 citations72
US9219183B2Dec 22, 2015
Photovoltaic thermal hybrid solar receivers
IBM5 citations71
US9591791B1Mar 7, 2017
System and method for cooling and delivering power to a computer system
IBM3 citations67
US11094840B2Aug 17, 2021
Photovoltaic system with non-uniformly cooled photovoltaic cells
IBM0 citations62
US10972048B2Apr 6, 2021
Photovoltaic module
IBM0 citations62
US10972047B2Apr 6, 2021
Photovoltaic module
IBM0 citations62
US10320328B2Jun 11, 2019
Photovoltaic thermal hybrid systems and method of operation thereof
IBM1 citations61
US11641785B2May 2, 2023
Ion milling for frequency tuning of superconducting qubits
IBM1 citations60
US10050165B2Aug 14, 2018
Photovoltaic system with non-uniformly cooled photovoltaic cells
IBM0 citations52
US10767939B2Sep 8, 2020
Disconnect assembly for active cooling of packaged electronics
IBM0 citations51
US9951977B2Apr 24, 2018
Adsorbing heat exchanger
IBM1 citations51
US9880595B2Jan 30, 2018
Cooling device with nested chambers for computer hardware
IBM0 citations51
US9058461B2Jun 16, 2015
Transferring heat through an optical layer of integrated circuitry
IBM0 citations51
US10031562B2Jul 24, 2018
Cooling electronic components and supplying power to the electronic components
IBM0 citations41
US9230832B2Jan 5, 2016
Method for manufacturing a filled cavity between a first and a second surface
IBM0 citations41
US10763189B2Sep 1, 2020
Sealing arrangement
IBM0 citations40
US10683776B2Jun 16, 2020
Device and method for converting heat into mechanical energy
IBM0 citations40
US9739179B2Aug 22, 2017
Working fluid for a device, device and method for converting heat into mechanical energy
IBM0 citations39
BAROWSKI HARRY
7 patentsUS8805132B2Aug 12, 2014
Integrated circuit package connected to a data transmission medium
BAROWSKI HARRY8 citations83
US8427833B2Apr 23, 2013
Thermal power plane for integrated circuits
BAROWSKI HARRY19 citations83
US8253234B2Aug 28, 2012
Optimized semiconductor packaging in a three-dimensional stack
BAROWSKI HARRY11 citations83
US8405998B2Mar 26, 2013
Heat sink integrated power delivery and distribution for integrated circuits
BAROWSKI HARRY5 citations72
US8989532B2Mar 24, 2015
Integrated circuit package connected to an optical data transmission medium using a coolant
BAROWSKI HARRY3 citations62
US8476112B2Jul 2, 2013
Optimized semiconductor packaging in a three-dimensional stack
BAROWSKI HARRY4 citations62
US9064080B2Jun 23, 2015
Transferring heat through an optical layer of integrated circuitry
BAROWSKI HARRY0 citations51