Inventor
BERNIER WILLIAM E
US29 patents
⚠️ This page may combine multiple inventors who share the name “BERNIER WILLIAM E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
21 patentsUS6559666B2May 6, 2003
Method and device for semiconductor testing using electrically conductive adhesives
IBM80 citations98
US6425772B1Jul 30, 2002
Conductive adhesive having a palladium matrix interface between two metal surfaces
IBM59 citations94
US6550667B2Apr 22, 2003
Flux composition and soldering method for high density arrays
IBM17 citations92
US6288559B1Sep 11, 2001
Semiconductor testing using electrically conductive adhesives
IBM20 citations92
US4374001AFeb 15, 1983
Electrolytic printing
IBM38 citations92
US4444626AApr 24, 1984
Electrochromic printing
IBM32 citations90
US7566649B2Jul 28, 2009
Compressible films surrounding solder connectors
IBM8 citations83
US7170187B2Jan 30, 2007
Low stress conductive polymer bump
IBM11 citations82
US7119003B2Oct 10, 2006
Extension of fatigue life for C4 solder ball to chip connection
IBM14 citations80
US6268739B1Jul 31, 2001
Method and device for semiconductor testing using electrically conductive adhesives
IBM12 citations74
US7442878B2Oct 28, 2008
Low stress conductive polymer bump
IBM7 citations72
US7332821B2Feb 19, 2008
Compressible films surrounding solder connectors
IBM7 citations72
US6331119B1Dec 18, 2001
Conductive adhesive having a palladium matrix interface between two metal surfaces
IBM14 citations71
US7316572B2Jan 8, 2008
Compliant electrical contacts
IBM6 citations62
US6492071B1Dec 10, 2002
Wafer scale encapsulation for integrated flip chip and surface mount technology assembly
IBM4 citations62
US4453171AJun 5, 1984
Reduced electrode wear in electrolytic printing by pH control of the print reaction zone
IBM2 citations59
US10699972B2Jun 30, 2020
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
IBM0 citations51
US9899279B2Feb 20, 2018
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
IBM0 citations51
US6921015B2Jul 26, 2005
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
IBM1 citations51
US6585150B1Jul 1, 2003
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
IBM0 citations51
US7067916B2Jun 27, 2006
Extension of fatigue life for C4 solder ball to chip connection
IBM0 citations48
UNIV NEW YORK STATE RES FOUND
5 patentsUS10661261B2May 26, 2020
Metal oxide nanofibrous materials for photodegradation of environmental toxins
UNIV NEW YORK STATE RES FOUND4 citations66
US12064753B2Aug 20, 2024
Metal oxide nanofibrous materials for photodegradation of environmental toxins
UNIV NEW YORK STATE RES FOUND0 citations55
US9920220B2Mar 20, 2018
Conductive films and devices comprised thereof
UNIV NEW YORK STATE RES FOUND0 citations42
US10459121B1Oct 29, 2019
Increased thermal stabilization of optical absorbers
UNIV NEW YORK STATE RES FOUND0 citations41
US9915757B1Mar 13, 2018
Increased thermal stabilization of optical absorbers
UNIV NEW YORK STATE RES FOUND0 citations41