Inventor

LEE TECK-CHONG

TW43 patents

⚠️ This page may combine multiple inventors who share the name “LEE TECK-CHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE TECK-CHONG

ADVANCED SEMICONDUCTOR ENG

Semiconductor device and method for manufacturing the same

Optical device and method of manufacturing the same

Electrical device

Semiconductor device packages and methods of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Package structure and method for manufacturing the same

Semiconductor device packages and methods of manufacturing the same

Semiconductor device and process of making the same

Flip chip package process

Semiconductor device package comprising a dielectric layer with built-in inductor

Two-stage die-bonding method for simultaneous die-bonding of multiple dies

Package structure and method for manufacturing the same

Semiconductor package and method for making the same

Semiconductor device packages including an inductor and a capacitor

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure

Optical device and electronic device

Semiconductor device packages including an inductor and a capacitor

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device packages and methods of manufacturing the same

Semiconductor device package and method for packaging the same

Package structure with interposer encapsulated by an encapsulant

Package structure with interposer encapsulated by an encapsulant

Package structure and method for manufacturing the same

Integrated passive component and method for manufacturing the same

Semiconductor device packages including an inductor and a capacitor

Assembly structure and method for manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor device and process of making the same

Electronic device package and method of manufacturing the same

Wire-bonding method for wire-bonding apparatus

Capacitor bank structure and semiconductor package structure

Semiconductor device and method of manufacturing the same

CHEN CHIEN-HUA

Semiconductor structure with passive element network and manufacturing method thereof

Semiconductor package having passive device and method for making the same

Semiconductor package and method for making the same

Semiconductor package having passive device and method for making the same

ASE SHANGHAI INC

Packaging substrate and manufacturing method thereof

TONG HO-MING

Thermally enhanced package structure