Inventor
LAI CHI-HUI
TW35 patents
Patents
35 patentsUS11183487B2Nov 23, 2021
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86
US10832985B2Nov 10, 2020
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations85
US10978382B2Apr 13, 2021
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US12009281B2Jun 11, 2024
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11769698B2Sep 26, 2023
Method of testing semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11742254B2Aug 29, 2023
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11355466B2Jun 7, 2022
Package structure and manufacturing method of package structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11239135B2Feb 1, 2022
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10985101B2Apr 20, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10840227B2Nov 17, 2020
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US12074143B2Aug 27, 2024
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11923349B2Mar 5, 2024
Semiconductor structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11417638B2Aug 16, 2022
Semiconductor structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11417633B2Aug 16, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12557707B2Feb 17, 2026
Method of fabricating package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412817B2Sep 9, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12255174B2Mar 18, 2025
Bonding passive devices on active dies to form 3D packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12243788B2Mar 4, 2025
Method of testing semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12205860B2Jan 21, 2025
Sensor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051666B2Jul 30, 2024
Package structure and manufacturing method of package structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12015017B2Jun 18, 2024
Package structure, package-on-package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11837575B2Dec 5, 2023
Bonding passive devices on active device dies to form 3D packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11804443B2Oct 31, 2023
Segregated power and ground design for yield improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11631658B2Apr 18, 2023
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527525B2Dec 13, 2022
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11488897B2Nov 1, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11121070B2Sep 14, 2021
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11107771B2Aug 31, 2021
Segregated power and ground design for yield improvement
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11049850B2Jun 29, 2021
Methods of bonding the strip-shaped under bump metallization structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011501B2May 18, 2021
Package structure, package-on-package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10861841B2Dec 8, 2020
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11164819B2Nov 2, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10790269B2Sep 29, 2020
Semiconductor devices and semiconductor structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10658348B2May 19, 2020
Semiconductor devices having a plurality of first and second conductive strips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11842993B2Dec 12, 2023
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51