Inventor
CHUN SHU-RONG
TW22 patents
Patents
22 patentsUS11183487B2Nov 23, 2021
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86
US11508656B2Nov 22, 2022
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations85
US10978382B2Apr 13, 2021
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11502013B2Nov 15, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11049805B2Jun 29, 2021
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11004758B2May 11, 2021
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11004827B2May 11, 2021
Semiconductor package and manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12412817B2Sep 9, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300571B2May 13, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12255174B2Mar 18, 2025
Bonding passive devices on active dies to form 3D packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12014979B2Jun 18, 2024
Methods of forming semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990381B2May 21, 2024
Integrated circuit packages having support rings
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11837575B2Dec 5, 2023
Bonding passive devices on active device dies to form 3D packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11804443B2Oct 31, 2023
Segregated power and ground design for yield improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11538735B2Dec 27, 2022
Method of forming integrated circuit packages with mechanical braces
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11488897B2Nov 1, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11121070B2Sep 14, 2021
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11107771B2Aug 31, 2021
Segregated power and ground design for yield improvement
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12166015B2Dec 10, 2024
Semiconductor package and manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11646296B2May 9, 2023
Semiconductor package and manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12374592B2Jul 29, 2025
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12525501B2Jan 13, 2026
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49