Inventor

KOHNO Yoshiko

JP2 patents

Patents

2 patents

US10328534B2Jun 25, 2019

Bonding material and bonding method using same

DOWA ELECTRONICS MATERIALS CO LTD2 citations68

US9662748B2May 30, 2017

Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method

DOWA ELECTRONICS MATERIALS CO LTD1 citations48