Inventor
NI CHIH-JUNG
TW9 patents
⚠️ This page may combine multiple inventors who share the name “NI CHIH-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WINBOND ELECTRONICS CORP
8 patentsUS6906377B2Jun 14, 2005
Flash memory cell and fabrication thereof
WINBOND ELECTRONICS CORP18 citations82
US7585754B2Sep 8, 2009
Method of forming bonding pad opening
WINBOND ELECTRONICS CORP4 citations57
US12087619B2Sep 10, 2024
Semiconductor device and method of fabricating the same
WINBOND ELECTRONICS CORP0 citations56
US11839075B2Dec 5, 2023
Semiconductor structure and the forming method thereof
WINBOND ELECTRONICS CORP0 citations55
US11302705B2Apr 12, 2022
Semiconductor structure and the forming method thereof
WINBOND ELECTRONICS CORP0 citations55
US12106964B2Oct 1, 2024
Double-patterning method to improve sidewall uniformity
WINBOND ELECTRONICS CORP0 citations48
US6852641B2Feb 8, 2005
Method of spiking mixed acid liquid in reactor
WINBOND ELECTRONICS CORP1 citations43
US6780780B2Aug 24, 2004
Method for removing Si-needles of wafer
WINBOND ELECTRONICS CORP0 citations42