Inventor

HUO ZONGLIANG

CN152 patents

⚠️ This page may combine multiple inventors who share the name “HUO ZONGLIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUO ZONGLIANG

YANGTZE MEMORY TECH CO LTD

Memory device using comb-like routing structure for reduced metal line loading

Memory device and forming method thereof

Staircase structures for three-dimensional memory device double-sided routing

Stacked connections in 3D memory and methods of making the same

Word line structure of three-dimensional memory device

Multiple-stack three-dimensional memory device and fabrication method thereof

Trench structures for three-dimensional memory devices

Word line structure of three-dimensional memory device

Openings layout of three-dimensional memory device

Methods for forming three-dimensional memory devices

Three-dimensional memory device with backside source contact

Three-dimensional memory device without gate line slits and method for forming the same

Method for forming three-dimensional memory device with backside source contact

Three-dimensional memory devices

Three-dimensional memory device with backside source contact

Methods for forming three-dimensional memory devices with supporting structure for staircase region

Three-dimensional memory and fabrication method thereof

Three-dimensional memory devices and fabricating methods thereof

Three-dimensional memory device without gate line slits and method for forming the same

Three-dimensional memory device and method for forming the same

Three-dimensional memory device with source structure and methods for forming the same

Methods for forming three-dimensional memory device with support structure and resulting three-dimensional memory device

Three-dimensional memory device with support structures in gate line slits and methods for forming the same

Three-dimensional memory device with support structures in slit structures and method for forming the same

Three-dimensional memory device having a shielding layer and method for forming the same

Three-dimensional memory devices and fabricating methods thereof

Method for manufacturing three-dimensional memory structure

Memory device using comb-like routing structure for reduced metal line loading

Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same

Memory device using comb-like routing structure for reduced metal line loading

Openings layout of three-dimensional memory device

Openings layout of three-dimensional memory device

Three-dimensional memory device with source contacts connected by an adhesion layer and methods for forming the same

Method and structure for cutting dense line patterns using self-aligned double patterning

Programming of memory cells in three-dimensional memory devices

Memory devices and methods for forming the same

Dynamic flash memory (DFM) with multi-cells

Control gate structures in three-dimensional memory devices and methods for forming the same

Three-dimensional memory devices

Three-dimensional memory devices and methods for forming the same

Methods for forming three-dimensional memory device

INST OF MICROELECTRONICS CAS

Vertical channel-type 3D semiconductor memory device and method for manufacturing the same

Method of manufacturing three-dimensional vertical and semiconductor device

Three-dimensional memory device and manufacturing method thereof

3-D semiconductor device and method for manufacturing the same

Vertical channel-type 3D semiconductor memory device and method for manufacturing the same

Three-dimensional semiconductor memory device with a substrate contact region and method of manufacturing the same

HUO ZONGLIANG

3D semiconductor memory device and manufacturing method thereof

Method for manufacturing three-dimensional semiconductor memory device

Semiconductor memory cell, device, and method for manufacturing the same