Inventor
PRICE DAVID T
US26 patents
⚠️ This page may combine multiple inventors who share the name “PRICE DAVID T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
15 patentsUS10431614B2Oct 1, 2019
Edge seals for semiconductor packages
SEMICONDUCTOR COMPONENTS IND LLC21 citations92
US10090342B1Oct 2, 2018
Stacked image sensor capacitors and related methods
SEMICONDUCTOR COMPONENTS IND LLC40 citations91
US9570494B1Feb 14, 2017
Method for forming a semiconductor image sensor device
SEMICONDUCTOR COMPONENTS IND LLC15 citations82
US10403659B2Sep 3, 2019
Stacked image sensor capacitors and related methods
SEMICONDUCTOR COMPONENTS IND LLC8 citations81
US12034025B2Jul 9, 2024
Semiconductor devices with single-photon avalanche diodes and isolation structures
SEMICONDUCTOR COMPONENTS IND LLC2 citations70
US12080739B2Sep 3, 2024
Global shutter sensor systems and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12211865B2Jan 28, 2025
Edge seals for semiconductor packages
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US11961859B2Apr 16, 2024
Edge seals for semiconductor packages
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US11670655B2Jun 6, 2023
Edge seals for semiconductor packages
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12532563B2Jan 20, 2026
Backside illumination image sensors
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US11756977B2Sep 12, 2023
Backside illumination image sensors
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12310139B2May 20, 2025
Semiconductor devices with single-photon avalanche diodes and isolation structures
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US9711556B2Jul 18, 2017
Semiconductor image sensor structure having metal-filled trench contact
SEMICONDUCTOR COMPONENTS IND LLC0 citations50
US11075148B2Jul 27, 2021
Stacked transistor assembly with dual middle mounting clips
SEMICONDUCTOR COMPONENTS IND LLC0 citations49
US11506687B2Nov 22, 2022
Method of forming a semiconductor device
SEMICONDUCTOR COMPONENTS IND LLC0 citations44
LSI LOGIC CORP
6 patentsUS6784045B1Aug 31, 2004
Microchannel formation for fuses, interconnects, capacitors, and inductors
LSI LOGIC CORP26 citations92
US6707132B1Mar 16, 2004
High performance Si-Ge device module with CMOS technology
LSI LOGIC CORP10 citations69
US6678950B1Jan 20, 2004
Method for forming a bonding pad on a substrate
LSI LOGIC CORP4 citations63
US7361965B2Apr 22, 2008
Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design
LSI LOGIC CORP2 citations62
US7582566B2Sep 1, 2009
Method for redirecting void diffusion away from vias in an integrated circuit design
LSI LOGIC CORP0 citations51
US6767842B2Jul 27, 2004
Implementation of Si-Ge HBT with CMOS process
LSI LOGIC CORP1 citations48
LSI CORP
3 patentsUS7955919B2Jun 7, 2011
Spacer-less transistor integration scheme for high-K gate dielectrics and small gate-to-gate spaces applicable to Si, SiGe and strained silicon schemes
LSI CORP8 citations83
US7436040B2Oct 14, 2008
Method and apparatus for diverting void diffusion in integrated circuit conductors
LSI CORP2 citations62
US7467363B2Dec 16, 2008
Method for SRAM bitmap verification
LSI CORP1 citations51