P

Inventor

PRICE DAVID T

US26 patents
⚠️ This page may combine multiple inventors who share the name “PRICE DAVID T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEMICONDUCTOR COMPONENTS IND LLC

15 patents
US10431614B2Oct 1, 2019

Edge seals for semiconductor packages

SEMICONDUCTOR COMPONENTS IND LLC21 citations92
US10090342B1Oct 2, 2018

Stacked image sensor capacitors and related methods

SEMICONDUCTOR COMPONENTS IND LLC40 citations91
US9570494B1Feb 14, 2017

Method for forming a semiconductor image sensor device

SEMICONDUCTOR COMPONENTS IND LLC15 citations82
US10403659B2Sep 3, 2019

Stacked image sensor capacitors and related methods

SEMICONDUCTOR COMPONENTS IND LLC8 citations81
US12034025B2Jul 9, 2024

Semiconductor devices with single-photon avalanche diodes and isolation structures

SEMICONDUCTOR COMPONENTS IND LLC2 citations70
US12080739B2Sep 3, 2024

Global shutter sensor systems and related methods

SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12211865B2Jan 28, 2025

Edge seals for semiconductor packages

SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US11961859B2Apr 16, 2024

Edge seals for semiconductor packages

SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US11670655B2Jun 6, 2023

Edge seals for semiconductor packages

SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12532563B2Jan 20, 2026

Backside illumination image sensors

SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US11756977B2Sep 12, 2023

Backside illumination image sensors

SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12310139B2May 20, 2025

Semiconductor devices with single-photon avalanche diodes and isolation structures

SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US9711556B2Jul 18, 2017

Semiconductor image sensor structure having metal-filled trench contact

SEMICONDUCTOR COMPONENTS IND LLC0 citations50
US11075148B2Jul 27, 2021

Stacked transistor assembly with dual middle mounting clips

SEMICONDUCTOR COMPONENTS IND LLC0 citations49
US11506687B2Nov 22, 2022

Method of forming a semiconductor device

SEMICONDUCTOR COMPONENTS IND LLC0 citations44

LSI LOGIC CORP

6 patents

LSI CORP

3 patents

PRICE DAVID T

1 patent

UNIV DUKE

1 patent