Inventor
HUANG HEH-CHANG
TW10 patents
Patents
10 patentsUS11694939B2Jul 4, 2023
Semiconductor package, integrated optical communication system
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11764123B2Sep 19, 2023
Semiconductor package, integrated optical communication system
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11101260B2Aug 24, 2021
Method of forming a dummy die of an integrated circuit having an embedded annular structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US12347817B2Jul 1, 2025
Semiconductor device package having warpage control
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12294002B2May 6, 2025
Integrated circuit package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261125B2Mar 25, 2025
Method for forming chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12015023B2Jun 18, 2024
Integrated circuit package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11978729B2May 7, 2024
Semiconductor device package having warpage control and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11804445B2Oct 31, 2023
Method for forming chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10872871B2Dec 22, 2020
Chip package structure with dummy bump and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51