Inventor
LEU SHYUE-TER
TW27 patents
Patents
27 patentsUS9653391B1May 16, 2017
Semiconductor packaging structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD23 citations94
US9881908B2Jan 30, 2018
Integrated fan-out package on package structure and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9870975B1Jan 16, 2018
Chip package with thermal dissipation structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US9721868B2Aug 1, 2017
Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9748156B1Aug 29, 2017
Semiconductor package assembly, semiconductor package and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11854956B2Dec 26, 2023
Semiconductor die package with conductive line crack prevention design
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11328971B2May 10, 2022
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10109547B2Oct 23, 2018
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11817382B2Nov 14, 2023
Package substrate insulation opening design
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11251114B2Feb 15, 2022
Package substrate insulation opening design
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US12412827B2Sep 9, 2025
Semiconductor die package with conductive line crack prevention design
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12354928B2Jul 8, 2025
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12347817B2Jul 1, 2025
Semiconductor device package having warpage control
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300632B2May 13, 2025
Chip package with lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261125B2Mar 25, 2025
Method for forming chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11996346B2May 28, 2024
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11978729B2May 7, 2024
Semiconductor device package having warpage control and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855009B2Dec 26, 2023
Chip package with lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11804445B2Oct 31, 2023
Method for forming chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11699631B2Jul 11, 2023
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11410939B2Aug 9, 2022
Chip package with lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12368092B2Jul 22, 2025
Package substrate insulation opening design
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12230593B2Feb 18, 2025
Wafer level package with polymer layer delamination prevention design and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12354884B2Jul 8, 2025
Method for making a packaging substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10797006B2Oct 6, 2020
Structure and formation method of chip package with lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163816B2Dec 25, 2018
Structure and formation method of chip package with lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10727147B2Jul 28, 2020
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51