Inventor
ADACHI TAKAO
27 patents
⚠️ This page may combine multiple inventors who share the name “ADACHI TAKAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ULTRAMEMORY INC
8 patentsUS10741525B2Aug 11, 2020
Semiconductor module
ULTRAMEMORY INC11 citations84
US11881248B2Jan 23, 2024
Three-dimensional semiconductor module including system in a package (SIP) with improved heat dissipation efficiency
ULTRAMEMORY INC2 citations68
US11183484B2Nov 23, 2021
Semiconductor module, DIMM module, manufacturing method of semiconductor module, and manufacturing method of DIMM module
ULTRAMEMORY INC3 citations68
US11410970B2Aug 9, 2022
Semiconductor module
ULTRAMEMORY INC0 citations61
US10714151B2Jul 14, 2020
Layered semiconductor device, and production method therefor
ULTRAMEMORY INC0 citations48
US10529385B2Jan 7, 2020
Layered semiconductor device, and production method therefor
ULTRAMEMORY INC0 citations48
US10269734B2Apr 23, 2019
Semiconductor element
ULTRAMEMORY INC0 citations41
US10615850B2Apr 7, 2020
Layered semiconductor device and data communication method
ULTRAMEMORY INC0 citations40
TOYODA GOSEI KK
3 patentsNEC CORP
3 patentsUS5117280AMay 26, 1992
Plastic package semiconductor device with thermal stress resistant structure
NEC CORP27 citations92
US5043792AAug 27, 1991
Integrated circuit having wiring strips for propagating in-phase signals
NEC CORP28 citations92
US5124778AJun 23, 1992
CMOS semiconductor integrated circuit device
NEC CORP13 citations73