Inventor
YOSHIZUMI AKIRA
19 patents
⚠️ This page may combine multiple inventors who share the name “YOSHIZUMI AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
16 patentsUS5641997AJun 24, 1997
Plastic-encapsulated semiconductor device
TOSHIBA KK442 citations98
US5907382AMay 25, 1999
Transparent conductive substrate and display apparatus
TOSHIBA KK61 citations95
US5336736AAug 9, 1994
Polysilane and polysilane composition
TOSHIBA KK20 citations92
US5325583AJul 5, 1994
Method for manufacturing printed circuit board
TOSHIBA KK32 citations92
US5272377ADec 21, 1993
Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition
TOSHIBA KK34 citations92
US5258426ANov 2, 1993
Semiconductor device encapsulant
TOSHIBA KK29 citations92
US5043211AAug 27, 1991
Epoxy resin composition and a resin-sealed semiconductor device
TOSHIBA KK26 citations92
US4719255AJan 12, 1988
Epoxy resin composition for encapsulation of semi-conductor device
TOSHIBA KK22 citations81
US5853952ADec 29, 1998
Color developing organic material, color developing resin composition and colored thin film pattern
TOSHIBA KK7 citations74
US5438113AAug 1, 1995
Thermosetting resin composition
TOSHIBA KK6 citations73
US5362559ANov 8, 1994
Polysilane monomolecular film and polysilane built-up film
TOSHIBA KK10 citations73
US5216077AJun 1, 1993
Rubber-modified phenolic resin composition and method of manufacturing the same
TOSHIBA KK17 citations72
US4916174AApr 10, 1990
Rubber-modified phenolic resin composition and method of manufacturing the same
TOSHIBA KK17 citations72
US5747557AMay 5, 1998
Method of manufacturing a castable epoxy resin composition comprising acrylic rubber particles predispersed in an anhydride hardener
TOSHIBA KK15 citations66
US5637667AJun 10, 1997
Thermosetting resin composition
TOSHIBA KK4 citations62
US5252639AOct 12, 1993
Molding resin composition and molded electronic component
TOSHIBA KK0 citations51