Inventor
SONG WOO BIN
KR31 patents
⚠️ This page may combine multiple inventors who share the name “SONG WOO BIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
23 patentsUS10388791B2Aug 20, 2019
Semiconductor device with adjacent source/drain regions connected by a semiconductor bridge, and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US10854612B2Dec 1, 2020
Semiconductor device including active region with variable atomic concentration of oxide semiconductor material and method of forming the same
SAMSUNG ELECTRONICS CO LTD10 citations83
US11417772B2Aug 16, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations73
US10692993B2Jun 23, 2020
Semiconductor device and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10014393B2Jul 3, 2018
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US11018137B2May 25, 2021
Semiconductor memory device
SAMSUNG ELECTRONICS CO LTD4 citations72
US9112015B2Aug 18, 2015
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD4 citations72
US10896951B2Jan 19, 2021
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD4 citations70
US12142671B2Nov 12, 2024
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US12101940B2Sep 24, 2024
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US12034047B2Jul 9, 2024
Semiconductor device including oxide semiconductor layer
SAMSUNG ELECTRONICS CO LTD0 citations62
US11862476B2Jan 2, 2024
Method of forming a semiconductor device including an active region with variable atomic concentration of oxide semiconductor material
SAMSUNG ELECTRONICS CO LTD0 citations62
US11832449B2Nov 28, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11532707B2Dec 20, 2022
Semiconductor device including oxide semiconductor layer
SAMSUNG ELECTRONICS CO LTD0 citations62
US11342330B2May 24, 2022
Semiconductor memory device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11171224B2Nov 9, 2021
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US10727348B2Jul 28, 2020
Semiconductor device with adjacent source/drain regions connected by a semiconductor bridge, and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US11488956B2Nov 1, 2022
Semiconductor memory device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11621353B2Apr 4, 2023
Semiconductor devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US10304834B2May 28, 2019
Semiconductor devices and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US12075611B2Aug 27, 2024
Semiconductor memory device
SAMSUNG ELECTRONICS CO LTD0 citations50
US12133009B2Oct 29, 2024
Image sensor, image sensing system, and image sensing method
SAMSUNG ELECTRONICS CO LTD0 citations48
US10776549B2Sep 15, 2020
Method of manufacturing a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations38
HYUNDAI MOBIS CO LTD
4 patentsUS12179532B2Dec 31, 2024
Suspension for vehicle
HYUNDAI MOBIS CO LTD0 citations62
US11938769B2Mar 26, 2024
Leaf spring apparatus for vehicle suspension
HYUNDAI MOBIS CO LTD1 citations62
US11358427B2Jun 14, 2022
Suspension for vehicle
HYUNDAI MOBIS CO LTD0 citations62
US12246566B2Mar 11, 2025
Suspension for vehicle
HYUNDAI MOBIS CO LTD1 citations56