Inventor

NAKASO AKISHI

JP27 patents

⚠️ This page may combine multiple inventors who share the name “NAKASO AKISHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAKASO AKISHI

HITACHI CHEMICAL CO LTD

Substrate for mounting semiconductor chips

Electronic component parts device

Metal foil for printed wiring board and production thereof

Process for producing multilayer printed circuit board

Process for producing printed wiring board

Prepreg for printed circuit board

Process for treating copper surface

Process for producing a printed wiring board

Metal foil for printed wiring board and production thereof

Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards

Electromagnetically shielding bonding film

Process for treating metal surface

Production of insulating varnishes and multilayer printed circuit boards using these varnishes

Process for producing multilayer printed circuit boards

Method of treating the surface of copper and copper

Printed wiring board and production thereof

Electroless copper deposition solution

Process for producing multilayer printed circuit boards

Chemical reducing solution for copper oxide

Aqueous solution for activation accelerating treatment

Electroless plating process

Wiring board and process for producing the same

Electroless copper plating solution

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

KAWAZOE HIROSHI

Micro fluid system support and manufacturing method thereof

Micro fluid system support and manufacturing method thereof

HITACHI LTD

Process for producing multilayer printed circuit board for wire bonding