Inventor
HOSHINO KAZUHIRO
JP38 patents
⚠️ This page may combine multiple inventors who share the name “HOSHINO KAZUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
15 patentsUS7825964B2Nov 2, 2010
Method of processing noise in image data, noise reduction unit, and imaging apparatus
SONY CORP20 citations93
US7375757B1May 20, 2008
Imaging element, imaging device, camera module and camera system
SONY CORP20 citations93
US6858827B2Feb 22, 2005
Solid-state image pickup apparatus and control method thereof
SONY CORP35 citations92
US6759642B2Jul 6, 2004
Image pick-up device, camera module and camera system
SONY CORP50 citations92
US6114764ASep 5, 2000
Semiconductor device and process for fabricating the same
SONY CORP19 citations92
US5972786AOct 26, 1999
Contact hole structure in a semiconductor and formation method therefor
SONY CORP21 citations92
US5776830AJul 7, 1998
Process for fabricating connection structures
SONY CORP22 citations92
US5532600AJul 2, 1996
Method of and apparatus for evaluating reliability of metal interconnect
SONY CORP29 citations92
US7579576B2Aug 25, 2009
Method of manufacturing a solid state image pickup apparatus having multiple transmission paths
SONY CORP8 citations84
US6395627B1May 28, 2002
Semiconductor device a burried wiring structure and process for fabricating the same
SONY CORP17 citations84
US7521656B2Apr 21, 2009
Solid-state image pickup apparatus and control method thereof
SONY CORP7 citations74
US7414663B2Aug 19, 2008
Imaging element, imaging device, camera module and camera system
SONY CORP6 citations74
US6265310B1Jul 24, 2001
Method of forming contact holes on a semiconductor surface
SONY CORP7 citations74
US6111318AAug 29, 2000
Semiconductor device comprising Cu--Ta and method for forming the semiconductor device
SONY CORP11 citations74
US5430258AJul 4, 1995
Copper interconnection structure and method of preparing same
SONY CORP13 citations74
SONY SEMICONDUCTOR SOLUTIONS CORP
8 patentsUS10217034B2Feb 26, 2019
Image processing device, imaging device, and image processing method
SONY SEMICONDUCTOR SOLUTIONS CORP8 citations84
US10885403B2Jan 5, 2021
Image processing device, imaging device, and image processing method
SONY SEMICONDUCTOR SOLUTIONS CORP1 citations73
US11514581B2Nov 29, 2022
Image capturing device, image capturing method, and image capturing system
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations72
US12009375B2Jun 11, 2024
Imaging device and imaging element
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11244209B2Feb 8, 2022
Image processing device, imaging device, and image processing method
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11863911B2Jan 2, 2024
Imaging system, method of controlling imaging system, and object recognition system
SONY SEMICONDUCTOR SOLUTIONS CORP1 citations53
US11997402B2May 28, 2024
Vehicular image capturing system and image capturing method
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations49
US10863129B2Dec 8, 2020
Imaging apparatus and imaging apparatus control method to reduce power consumption without reduction of number of pixel signals
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations41
FURUKAWA ELECTRIC CO LTD
4 patentsUS7771841B2Aug 10, 2010
Ultrathin copper foil with carrier and printed circuit board using same
FURUKAWA ELECTRIC CO LTD12 citations82
US7985485B2Jul 26, 2011
Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
FURUKAWA ELECTRIC CO LTD3 citations61
US7985488B2Jul 26, 2011
Ultrathin copper foil with carrier and printed circuit board using same
FURUKAWA ELECTRIC CO LTD2 citations61
US7892655B2Feb 22, 2011
Ultrathin copper foil with carrier and printed circuit board using same
FURUKAWA ELECTRIC CO LTD0 citations50
SUMITOMO WIRING SYSTEMS
3 patentsCIRCUIT FOIL JAPAN
3 patentsUS7175920B2Feb 13, 2007
Copper foil for high-density ultra-fine printed wiring board
CIRCUIT FOIL JAPAN25 citations91
US7026059B2Apr 11, 2006
Copper foil for high-density ultrafine printed wiring boad
CIRCUIT FOIL JAPAN36 citations91
US5792333AAug 11, 1998
Method of surface-roughening treatment of copper foil
CIRCUIT FOIL JAPAN25 citations90