Inventor
TAKANO TERUNARI
JP4 patents
Patents
4 patentsUS6326243B1Dec 4, 2001
Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
TOSHIBA KK200 citations97
US5753969AMay 19, 1998
Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
TOSHIBA KK25 citations91
US6777313B2Aug 17, 2004
Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time
TOSHIBA KK17 citations82
US6545348B1Apr 8, 2003
Package for a semiconductor device comprising a plurality of interconnection patterns around a semiconductor chip
TOSHIBA KK17 citations81