Inventor
YOSHIDA AKITO
JP39 patents
⚠️ This page may combine multiple inventors who share the name “YOSHIDA AKITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
16 patentsUS6987314B1Jan 17, 2006
Stackable semiconductor package with solder on pads on which second semiconductor package is stacked
AMKOR TECHNOLOGY INC106 citations99
US9012789B1Apr 21, 2015
Stackable via package and method
AMKOR TECHNOLOGY INC31 citations97
US9730327B1Aug 8, 2017
Stackable via package and method
AMKOR TECHNOLOGY INC10 citations92
US7652361B1Jan 26, 2010
Land patterns for a semiconductor stacking structure and method therefor
AMKOR TECHNOLOGY INC20 citations92
US6750545B1Jun 15, 2004
Semiconductor package capable of die stacking
AMKOR TECHNOLOGY INC34 citations92
US10206285B1Feb 12, 2019
Stackable via package and method
AMKOR TECHNOLOGY INC5 citations84
US10034372B1Jul 24, 2018
Stackable via package and method
AMKOR TECHNOLOGY INC3 citations84
US7459349B1Dec 2, 2008
Method of forming a stack of semiconductor packages
AMKOR TECHNOLOGY INC9 citations84
US7154171B1Dec 26, 2006
Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
AMKOR TECHNOLOGY INC16 citations84
US7982306B1Jul 19, 2011
Stackable semiconductor package
AMKOR TECHNOLOGY INC5 citations74
US7737542B1Jun 15, 2010
Stackable semiconductor package
AMKOR TECHNOLOGY INC5 citations74
US7429799B1Sep 30, 2008
Land patterns for a semiconductor stacking structure and method therefor
AMKOR TECHNOLOGY INC6 citations74
US10257942B1Apr 9, 2019
Stackable variable height via package and method
AMKOR TECHNOLOGY INC5 citations73
US10548221B1Jan 28, 2020
Stackable via package and method
AMKOR TECHNOLOGY INC0 citations52
US8022521B1Sep 20, 2011
Package failure prognostic structure and method
AMKOR TECHNOLOGY INC0 citations52
US7691745B1Apr 6, 2010
Land patterns for a semiconductor stacking structure and method therefor
AMKOR TECHNOLOGY INC1 citations52
YOSHIDA AKITO
6 patentsUS8222538B1Jul 17, 2012
Stackable via package and method
YOSHIDA AKITO91 citations98
US8471154B1Jun 25, 2013
Stackable variable height via package and method
YOSHIDA AKITO71 citations97
US8623753B1Jan 7, 2014
Stackable protruding via package and method
YOSHIDA AKITO41 citations93
US8704368B1Apr 22, 2014
Stackable via package and method
YOSHIDA AKITO15 citations92
US8227905B1Jul 24, 2012
Stackable semiconductor package
YOSHIDA AKITO2 citations62
US8466545B1Jun 18, 2013
Stackable semiconductor package
YOSHIDA AKITO0 citations52
TOSHIBA KK
6 patentsUS6326243B1Dec 4, 2001
Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
TOSHIBA KK200 citations97
US6445001B2Sep 3, 2002
Semiconductor device with flip-chip structure and method of manufacturing the same
TOSHIBA KK67 citations96
US5329068AJul 12, 1994
Semiconductor device
TOSHIBA KK20 citations92
US5291374AMar 1, 1994
Semiconductor device having an opening and method of manufacturing the same
TOSHIBA KK41 citations92
US5753969AMay 19, 1998
Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
TOSHIBA KK25 citations91
US5157476AOct 20, 1992
Tape carrier having improved test pads
TOSHIBA KK14 citations74
SUMITOMO ELECTRIC INDUSTRIES
5 patentsUS4632817ADec 30, 1986
Method of synthesizing diamond
SUMITOMO ELECTRIC INDUSTRIES62 citations96
US5785039AJul 28, 1998
Single-crystalline diamond tip for dresser and dresser employing the same
SUMITOMO ELECTRIC INDUSTRIES20 citations93
US6007916ADec 28, 1999
Synthetic single crystal diamond for wiring drawing dies and process for producing the same
SUMITOMO ELECTRIC INDUSTRIES25 citations92
US5133332AJul 28, 1992
Diamond tool
SUMITOMO ELECTRIC INDUSTRIES41 citations92
US5560241AOct 1, 1996
Synthetic single crystal diamond for wire drawing dies
SUMITOMO ELECTRIC INDUSTRIES12 citations73
AMKOR TECH SINGAPORE HOLDING PTE LTD
4 patentsUS12035472B2Jul 9, 2024
Stackable via package and method
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11700692B2Jul 11, 2023
Stackable via package and method
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11089685B2Aug 10, 2021
Stackable via package and method
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12557657B2Feb 17, 2026
Electronic devices and methods of manufacturing electronic devices
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations44