Inventor
LAI HU-KONG
US3 patents
Patents
3 patentsUS5801440ASep 1, 1998
Chip package board having utility rings
ACC MICROELECTRONICS CORP238 citations95
US5686699ANov 11, 1997
Semiconductor board providing high signal pin utilization
ACC MICROELECTRONICS CORP75 citations92
US5703402ADec 30, 1997
Output mapping of die pad bonds in a ball grid array
ACC MICROELECTRONICS CORP36 citations89