Inventor

NAKAMURA KENSUKE

JP55 patents

⚠️ This page may combine multiple inventors who share the name “NAKAMURA KENSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAKAMURA KENSUKE

DAIICHI SANKYO CO LTD

Anti-GPR20 antibody and anti-GPR20 antibody-drug conjugate

Antibody-drug conjugates comprising substituted benzo[e]pyrrolo[1,2-a][1,4]diazepines

Antibody-drug conjugates comprising substituted benzo[e]pyrrolo[1,2-α][1,4]diazepines

Antibody-pyrrolobenzodiazepine derivative conjugate and method of use thereof for treating a tumor

Anti-CDH6 antibody and anti-CDH6 antibody-drug conjugate

Anti-human TLR7 antibody

Anti-GPR20 antibody and anti-GPR20 antibody-drug conjugate

Methods of treating a tumor by administering a claudin-6 (CLDN6) or CLDN9 antibody-pyrrolobenzodiazepine derivative conjugate

Polynucleotides encoding antibodies which bind the EC3 domain of cadherin-6 (CDH6) and possess internalization ability

Anti-CDH6 antibody and method of producing an anti-CDH6 antibody-drug conjugate

Endos mutant enzyme

Anti-CD3 antibody and molecules comprising the antibody

Anti-human TLR7 antibody

Anti-GPR20 antibody

Methods for treating autoimmune diseases incorporating an anti-LAG3 antibody

Endo-beta-N-acetylglucosaminidase

Antibody for treating autoimmune diseases

HONDA MOTOR CO LTD

Tensioner for an endless transmitting member

Balancer shaft supporting structure in engine

Assembling arrangement for tensioner and hydraulic control valve

Tensioner device

Separator structure of chain case

Rotary shaft lubricating structure

SUMITOMO BAKELITE CO

Transfer bump street, semiconductor flip chip and method of producing same

Manufacturing method for semiconductor device

Method of manufacturing electronic part and electronic part obtained by the method

Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device

Solder resist material, wiring board using the solder resist material, and semiconductor package

NAKAMURA KENSUKE

Vehicle brake control system

Method of manufacturing semiconductor device, block stacked body, and sequential stacked body

Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the same

BORG WARNER AUTOMOTIVE KK

Blade chain tensioner

Silent chain having a sheared link bearing surface

Blade tensioner and system for a chain

UNIV SAITAMA MEDICAL

Anti-ALK2 antibody

Anti-ALK2 antibody

Anti-ALK2 antibody

KOKUYO KK

Chair

Chair

Chair

UNIV MIE

Bispecific antibody

Bispecific antibody

UNIV KOBE NAT UNIV CORP

Anti-SIRPα antibody

Anti-SIRPalpha antibody

MARUYAMA HIRONORI

Multilayered circuit board and semiconductor device

USHIO ELECTRIC INC

Dielectric barrier plasma generator and plasma discharge starting method for dielectric barrier plasma generator

TACHIBANA KENYA

Semiconductor package, core layer material, buildup layer material, and sealing resin composition

MITSUI MINING & SMELTING CO

Multilayered printed wiring board and manufacturing method thereof

YOSHIZAKI KAZUYUKI

Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body