Inventor

OSENBACH JOHN W

US48 patents

⚠️ This page may combine multiple inventors who share the name “OSENBACH JOHN W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OSENBACH JOHN W

INFINERA CORP

Photonic integrated circuit package

Photonic integrated circuit package

Tunable waveguide devices

Tunable waveguide devices

Photonic integrated circuit package

Photonic integrated circuit (PIC) and silicon photonics (SIP) circuitry device

Low-cost nano-heat pipe

Hybrid integrated circuit package

Tunable waveguide devices

Tunable waveguide devices

Tunable waveguide devices

Tunable waveguide devices

Low-cost nano-heat pipe

Thermal interface material containment

LSI CORP

Solder interconnect by addition of copper

Method for fabricating equal height metal pillars of different diameters

Whisker-free lead frames

Solder interconnect by addition of copper

Stacked interconnect heat sink

Moisture barrier for a wire bond

Method of manufacturing an electronic device package

AGERE SYSTEMS INC

Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate

Plastic overmolded packages with mechanically decoupled lid attach attachment

Robust electronic device packages

Controlling warping in integrated circuit devices

Controlling warping in integrated circuit devices

Controlling warping in integrated circuit devices

Plastic overmolded packages with mechancially decoupled lid attach attachment

AT & T BELL LAB

Protective layer for high voltage devices

Substantially facet-free selective epitaxial growth process

Bipolar fabrication method

Substantially facet-free selective epitaxial growth process

LUCENT TECHNOLOGIES INC

Method for fabricating a planar dielectric

Method and apparatus for passively aligning components on semiconductor dies

Method for removing thin, organic materials from semiconductor dies and micro-lenses

AT & T CORP

Method of fabrication for electro-optical devices

Article comprising a semiconductor laser with stble facet coating

OSENBACH JOHN W

Mitigation of whiskers in Sn-films

Controlling warping in integrated circuit devices

BACHMAN MARK

PB-free solder bumps with improved mechanical properties

Pb-free solder bumps with improved mechanical properties

BACHMAN MARK A

Stacked interconnect heat sink

AGERE SYST GUARDIAN CORP

Forming attached features on a semiconductor substrate

DELUCCA JOHN M

Moisture barrier for a wire bond

ANTOL JOZE E

Bond pad support structure for semiconductor device

TRIQUINT TECHNOLOGY HOLDING CO

Optical fiber assembly and method for suppressing optical instabilities due to improperly cured epoxy

BAIOCCHI FRANK A

Aluminum bond pads with enhanced wire bond stability

GOLICK LARRY W

Lead frame design to improve reliability