Inventor
LAI JANE-BAI
TW9 patents
⚠️ This page may combine multiple inventors who share the name “LAI JANE-BAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
8 patentsUS6136680AOct 24, 2000
Methods to improve copper-fluorinated silica glass interconnects
TAIWAN SEMICONDUCTOR MFG133 citations97
US6015749AJan 18, 2000
Method to improve adhesion between copper and titanium nitride, for copper interconnect structures, via the use of an ion implantation procedure
TAIWAN SEMICONDUCTOR MFG104 citations97
US6423625B1Jul 23, 2002
Method of improving the bondability between Au wires and Cu bonding pads
TAIWAN SEMICONDUCTOR MFG15 citations92
US6399487B1Jun 4, 2002
Method of reducing phase transition temperature by using silicon-germanium alloys
TAIWAN SEMICONDUCTOR MFG21 citations89
US6083829AJul 4, 2000
Use of a low resistivity Cu3 Ge interlayer as an adhesion promoter between copper and tin layers
TAIWAN SEMICONDUCTOR MFG16 citations83
US7208415B2Apr 24, 2007
Plasma treatment method for electromigration reduction
TAIWAN SEMICONDUCTOR MFG8 citations73
US6660655B2Dec 9, 2003
Method and solution for preparing SEM samples for low-K materials
TAIWAN SEMICONDUCTOR MFG3 citations61
US6780783B2Aug 24, 2004
Method of wet etching low dielectric constant materials
TAIWAN SEMICONDUCTOR MFG4 citations59