Inventor
JU DONG-HYUK
US44 patents
⚠️ This page may combine multiple inventors who share the name “JU DONG-HYUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
36 patentsUS6548361B1Apr 15, 2003
SOI MOSFET and method of fabrication
ADVANCED MICRO DEVICES INC84 citations98
US6465852B1Oct 15, 2002
Silicon wafer including both bulk and SOI regions and method for forming same on a bulk silicon wafer
ADVANCED MICRO DEVICES INC65 citations96
US6376286B1Apr 23, 2002
Field effect transistor with non-floating body and method for forming same on a bulk silicon wafer
ADVANCED MICRO DEVICES INC65 citations96
US6229187B1May 8, 2001
Field effect transistor with non-floating body and method for forming same on a bulk silicon wafer
ADVANCED MICRO DEVICES INC55 citations96
US6200863B1Mar 13, 2001
Process for fabricating a semiconductor device having assymetric source-drain extension regions
ADVANCED MICRO DEVICES INC64 citations96
US5846857ADec 8, 1998
CMOS processing employing removable sidewall spacers for independently optimized N- and P-channel transistor performance
ADVANCED MICRO DEVICES INC60 citations96
US6512244B1Jan 28, 2003
SOI device with structure for enhancing carrier recombination and method of fabricating same
ADVANCED MICRO DEVICES INC60 citations95
US6713819B1Mar 30, 2004
SOI MOSFET having amorphized source drain and method of fabrication
ADVANCED MICRO DEVICES INC45 citations93
US6562676B1May 13, 2003
Method of forming differential spacers for individual optimization of n-channel and p-channel transistors
ADVANCED MICRO DEVICES INC38 citations93
US6518631B1Feb 11, 2003
Multi-Thickness silicide device formed by succesive spacers
ADVANCED MICRO DEVICES INC25 citations93
US6441433B1Aug 27, 2002
Method of making a multi-thickness silicide SOI device
ADVANCED MICRO DEVICES INC24 citations93
US6424009B1Jul 23, 2002
Polysilicon insulator material in semiconductor-on-insulator (SOI) structure
ADVANCED MICRO DEVICES INC43 citations93
US6232166B1May 15, 2001
CMOS processing employing zero degree halo implant for P-channel transistor
ADVANCED MICRO DEVICES INC28 citations93
US5998272ADec 7, 1999
Silicidation and deep source-drain formation prior to source-drain extension formation
ADVANCED MICRO DEVICES INC30 citations93
US5972760AOct 26, 1999
Method of manufacturing a semiconductor device containing shallow LDD junctions
ADVANCED MICRO DEVICES INC25 citations93
US5943565AAug 24, 1999
CMOS processing employing separate spacers for independently optimized transistor performance
ADVANCED MICRO DEVICES INC41 citations93
US6433391B1Aug 13, 2002
Bonded SOI for floating body and metal gettering control
ADVANCED MICRO DEVICES INC20 citations92
US6051473AApr 18, 2000
Fabrication of raised source-drain transistor devices
ADVANCED MICRO DEVICES INC45 citations92
US6008099ADec 28, 1999
Fabrication process employing a single dopant implant for formation of a drain extension region and a drain region of an LDD MOSFET using enhanced lateral diffusion
ADVANCED MICRO DEVICES INC39 citations92
US5879975AMar 9, 1999
Heat treating nitrogen implanted gate electrode layer for improved gate electrode etch profile
ADVANCED MICRO DEVICES INC33 citations91
US7011998B1Mar 14, 2006
High voltage transistor scaling tilt ion implant method
ADVANCED MICRO DEVICES INC30 citations90
US6566213B2May 20, 2003
Method of fabricating multi-thickness silicide device formed by disposable spacers
ADVANCED MICRO DEVICES INC15 citations84
US6300207B1Oct 9, 2001
Depleted sidewall-poly LDD transistor
ADVANCED MICRO DEVICES INC16 citations84
US7122863B1Oct 17, 2006
SOI device with structure for enhancing carrier recombination and method of fabricating same
ADVANCED MICRO DEVICES INC17 citations83
US6538284B1Mar 25, 2003
SOI device with body recombination region, and method
ADVANCED MICRO DEVICES INC18 citations83
US6897518B1May 24, 2005
Flash memory cell having reduced leakage current
ADVANCED MICRO DEVICES INC10 citations74
US6492830B1Dec 10, 2002
Method and circuit for measuring charge dump of an individual transistor in an SOI device
ADVANCED MICRO DEVICES INC7 citations74
US6316319B1Nov 13, 2001
Method of manufacturing a semiconductor device having shallow junctions
ADVANCED MICRO DEVICES INC9 citations74
US6277698B1Aug 21, 2001
Method of manufacturing semiconductor devices having uniform, fully doped gate electrodes
ADVANCED MICRO DEVICES INC10 citations74
US6245623B1Jun 12, 2001
CMOS semiconductor device containing N-channel transistor having shallow LDD junctions
ADVANCED MICRO DEVICES INC7 citations74
US6232208B1May 15, 2001
Semiconductor device and method of manufacturing a semiconductor device having an improved gate electrode profile
ADVANCED MICRO DEVICES INC14 citations74
US6535015B1Mar 18, 2003
Device and method for testing performance of silicon structures
ADVANCED MICRO DEVICES INC11 citations73
US7026230B1Apr 11, 2006
Method for fabricating a memory device
ADVANCED MICRO DEVICES INC2 citations63
US6717212B2Apr 6, 2004
Leaky, thermally conductive insulator material (LTCIM) in semiconductor-on-insulator (SOI) structure
ADVANCED MICRO DEVICES INC5 citations63
US6476446B2Nov 5, 2002
Heat removal by removal of buried oxide in isolation areas
ADVANCED MICRO DEVICES INC4 citations63
US7253068B1Aug 7, 2007
Dual SOI film thickness for body resistance control
ADVANCED MICRO DEVICES INC5 citations61
SPANSION LLC
3 patentsUS7776696B2Aug 17, 2010
Method to obtain multiple gate thicknesses using in-situ gate etch mask approach
SPANSION LLC2 citations57
US8633083B1Jan 21, 2014
Apparatus and method for a metal oxide semiconductor field effect transistor with source side punch-through protection implant
SPANSION LLC0 citations52
US7939440B2May 10, 2011
Junction leakage suppression in memory devices
SPANSION LLC0 citations52