Inventor
KUEHN EBERHARD
DE31 patents
⚠️ This page may combine multiple inventors who share the name “KUEHN EBERHARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SIEMENS AG
25 patentsUS4339521AJul 13, 1982
Heat resistant positive resists containing polyoxazoles
SIEMENS AG121 citations97
US5250375AOct 5, 1993
Photostructuring process
SIEMENS AG66 citations96
US4395482AJul 26, 1983
Method for the preparation of heat-resistant relief structures using positive resists
SIEMENS AG86 citations96
US5486447AJan 23, 1996
Negative resists with high thermal stability comprising end capped polybenzoxazole and bisazide
SIEMENS AG37 citations92
US5081000AJan 14, 1992
Photosensitive mixture
SIEMENS AG31 citations92
US4371685AFeb 1, 1983
Radiation-reactive precursor stages of highly heat-resistant polymers
SIEMENS AG33 citations92
US5922825AJul 13, 1999
Preparation of poly-o-hydroxyamides and poly o-mercaptoamides
SIEMENS AG18 citations84
US4329556AMay 11, 1982
N-Azidosulfonylaryl-maleinimides
SIEMENS AG25 citations82
US4311785AJan 19, 1982
Method for the preparation of highly heat-resistant relief structures and the use thereof
SIEMENS AG27 citations82
US4287294ASep 1, 1981
Method for the preparation of relief structures by phototechniques
SIEMENS AG24 citations82
US5883221AMar 16, 1999
Synthesis of polybenzoxasole and polybenzothiazole precursors
SIEMENS AG18 citations81
US4654415AMar 31, 1987
Method for the preparation of polyimide and polyisoindoloquinazoline dione precursors
SIEMENS AG18 citations74
US4397999AAug 9, 1983
Polyimidazole and polyimidazopyrrolone precursor stages and the preparation thereof
SIEMENS AG10 citations74
US4385165AMay 24, 1983
Polyimide, polyisoindoloquinazoline dione, polyoxazine dione and polyquinazoline dione precursor stages and the manufacture
SIEMENS AG17 citations74
US4366230ADec 28, 1982
Method for the preparation of highly heat-resistant relief structures and the use thereof
SIEMENS AG8 citations74
US4332883AJun 1, 1982
Method for the manufacture of highly heat-resistant relief structures
SIEMENS AG9 citations74
US4292398ASep 29, 1981
Method for the preparation of relief structures by phototechniques
SIEMENS AG7 citations74
US5703186ADec 30, 1997
Mixed polymers
SIEMENS AG5 citations73
US4398009AAug 9, 1983
Polyoxazole precursor and the preparation thereof
SIEMENS AG6 citations63
US4332882AJun 1, 1982
Method for the preparation of highly heat-resistant relief
SIEMENS AG6 citations63
US5616667AApr 1, 1997
Copolymers
SIEMENS AG4 citations62
US5807969ASep 15, 1998
Preparation of poly-O-hydroxyamides and poly O-mercaptoamides
SIEMENS AG6 citations61
US5733706AMar 31, 1998
Dry-developable positive resist
SIEMENS AG6 citations61
US5194629AMar 16, 1993
Process for producing n-tertiary butoxycarbonyl-maleinimide
SIEMENS AG4 citations61
US5750711AMay 12, 1998
Dicarboxylic acid derivatives
SIEMENS AG2 citations57
INFINEON TECHNOLOGIES AG
6 patentsUS6893972B2May 17, 2005
Process for sidewall amplification of resist structures and for the production of structures having reduced structure size
INFINEON TECHNOLOGIES AG280 citations97
US6770423B2Aug 3, 2004
Negative resist process with simultaneous development and silylation
INFINEON TECHNOLOGIES AG7 citations72
US6841332B2Jan 11, 2005
Photoresist compound and method for structuring a photoresist layer
INFINEON TECHNOLOGIES AG5 citations62
US7052820B2May 30, 2006
Silicon-containing resist for photolithography
INFINEON TECHNOLOGIES AG3 citations61
US6946236B2Sep 20, 2005
Negative resist process with simultaneous development and aromatization of resist structures
INFINEON TECHNOLOGIES AG2 citations61
US7018784B2Mar 28, 2006
Process for increasing the etch resistance and for reducing the hole and trench width of a photoresist structure using solvent systems of low polarity
INFINEON TECHNOLOGIES AG0 citations40