Inventor
SMALL ROBERT J
US45 patents
⚠️ This page may combine multiple inventors who share the name “SMALL ROBERT J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EKC TECHNOLOGY INC
25 patentsUS6156661ADec 5, 2000
Post clean treatment
EKC TECHNOLOGY INC164 citations99
US5981454ANov 9, 1999
Post clean treatment composition comprising an organic acid and hydroxylamine
EKC TECHNOLOGY INC272 citations99
US6546939B1Apr 15, 2003
Post clean treatment
EKC TECHNOLOGY INC106 citations98
US5911835AJun 15, 1999
Method of removing etching residue
EKC TECHNOLOGY INC102 citations98
US6313039B1Nov 6, 2001
Chemical mechanical polishing composition and process
EKC TECHNOLOGY INC125 citations97
US6248704B1Jun 19, 2001
Compositions for cleaning organic and plasma etched residues for semiconductors devices
EKC TECHNOLOGY INC116 citations97
US6235693B1May 22, 2001
Lactam compositions for cleaning organic and plasma etched residues for semiconductor devices
EKC TECHNOLOGY INC111 citations97
US6117783ASep 12, 2000
Chemical mechanical polishing composition and process
EKC TECHNOLOGY INC240 citations97
US6110881AAug 29, 2000
Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
EKC TECHNOLOGY INC61 citations96
US6635186B1Oct 21, 2003
Chemical mechanical polishing composition and process
EKC TECHNOLOGY INC45 citations95
US6916772B2Jul 12, 2005
Sulfoxide pyrolid(in)one alkanolamine cleaner composition
EKC TECHNOLOGY INC58 citations94
US6777380B2Aug 17, 2004
Compositions for cleaning organic and plasma etched residues for semiconductor devices
EKC TECHNOLOGY INC59 citations94
US6498131B1Dec 24, 2002
Composition for cleaning chemical mechanical planarization apparatus
EKC TECHNOLOGY INC56 citations94
US7051742B2May 30, 2006
Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
EKC TECHNOLOGY INC12 citations92
US7456140B2Nov 25, 2008
Compositions for cleaning organic and plasma etched residues for semiconductor devices
EKC TECHNOLOGY INC24 citations91
US7419911B2Sep 2, 2008
Compositions and methods for rapidly removing overfilled substrates
EKC TECHNOLOGY INC37 citations90
US6638326B2Oct 28, 2003
Compositions for chemical mechanical planarization of tantalum and tantalum nitride
EKC TECHNOLOGY INC22 citations90
US6756308B2Jun 29, 2004
Chemical-mechanical planarization using ozone
EKC TECHNOLOGY INC21 citations89
US7135445B2Nov 14, 2006
Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials
EKC TECHNOLOGY INC27 citations88
US6645930B1Nov 11, 2003
Clean room wipes for neutralizing caustic chemicals
EKC TECHNOLOGY INC28 citations86
US7144849B2Dec 5, 2006
Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
EKC TECHNOLOGY INC11 citations84
US6866792B2Mar 15, 2005
Compositions for chemical mechanical planarization of copper
EKC TECHNOLOGY INC15 citations82
US7273060B2Sep 25, 2007
Methods for chemically treating a substrate using foam technology
EKC TECHNOLOGY INC16 citations81
US6852682B2Feb 8, 2005
Composition for cleaning chemical mechanical planarization apparatus
EKC TECHNOLOGY INC9 citations71
US7387130B2Jun 17, 2008
Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
EKC TECHNOLOGY INC4 citations63
DUPONT AIR PROD NANOMATERIALS
10 patentsUS7029508B2Apr 18, 2006
Catalyst attached to solid and used to promote free radical formation in CMP formulations
DUPONT AIR PROD NANOMATERIALS56 citations93
US7427305B2Sep 23, 2008
Free radical-forming activator attached to solid and used to enhance CMP formulations
DUPONT AIR PROD NANOMATERIALS16 citations89
US7014669B2Mar 21, 2006
Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
DUPONT AIR PROD NANOMATERIALS32 citations87
US7427361B2Sep 23, 2008
Particulate or particle-bound chelating agents
DUPONT AIR PROD NANOMATERIALS39 citations86
US7247566B2Jul 24, 2007
CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers
DUPONT AIR PROD NANOMATERIALS23 citations86
US7513920B2Apr 7, 2009
Free radical-forming activator attached to solid and used to enhance CMP formulations
DUPONT AIR PROD NANOMATERIALS17 citations82
US7968465B2Jun 28, 2011
Periodic acid compositions for polishing ruthenium/low K substrates
DUPONT AIR PROD NANOMATERIALS9 citations78
US7276180B2Oct 2, 2007
Chemical mechanical polishing composition and process
DUPONT AIR PROD NANOMATERIALS4 citations72
US7033942B2Apr 25, 2006
Chemical mechanical polishing composition and process
DUPONT AIR PROD NANOMATERIALS8 citations72
US7524346B2Apr 28, 2009
Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates
DUPONT AIR PROD NANOMATERIALS4 citations59
SMALL ROBERT J
2 patentsUS7368388B2May 6, 2008
Cerium oxide abrasives for chemical mechanical polishing
SMALL ROBERT J20 citations88
US8142675B2Mar 27, 2012
Compositions for chemical-mechanical planarization of noble-metal-featured substrates, associated methods, and substrates produced by such methods
SMALL ROBERT J0 citations46