P

Inventor

O'DONNELL ROBERT J

US28 patents
⚠️ This page may combine multiple inventors who share the name “O'DONNELL ROBERT J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

24 patents
US7300537B2Nov 27, 2007

Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor

LAM RES CORP64 citations98
US6537429B2Mar 25, 2003

Diamond coatings on reactor wall and method of manufacturing thereof

LAM RES CORP110 citations98
US7311797B2Dec 25, 2007

Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor

LAM RES CORP50 citations96
US6988326B2Jan 24, 2006

Phobic barrier meniscus separation and containment

LAM RES CORP59 citations96
US6954993B1Oct 18, 2005

Concentric proximity processing head

LAM RES CORP64 citations96
US6830622B2Dec 14, 2004

Cerium oxide containing ceramic components and coatings in semiconductor processing equipment and methods of manufacture thereof

LAM RES CORP63 citations96
US6780787B2Aug 24, 2004

Low contamination components for semiconductor processing apparatus and methods for making components

LAM RES CORP53 citations96
US6620520B2Sep 16, 2003

Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof

LAM RES CORP54 citations96
US6613442B2Sep 2, 2003

Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof

LAM RES CORP49 citations96
US6533910B2Mar 18, 2003

Carbonitride coated component of semiconductor processing equipment and method of manufacturing thereof

LAM RES CORP62 citations96
US5994235ANov 30, 1999

Methods for etching an aluminum-containing layer

LAM RES CORP51 citations96
US7363727B2Apr 29, 2008

Method for utilizing a meniscus in substrate processing

LAM RES CORP19 citations92
US7255898B2Aug 14, 2007

Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof

LAM RES CORP29 citations92
US7093375B2Aug 22, 2006

Apparatus and method for utilizing a meniscus in substrate processing

LAM RES CORP37 citations92
US6773751B2Aug 10, 2004

Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof

LAM RES CORP26 citations92
US7605086B2Oct 20, 2009

Corrosion resistant component of semiconductor processing equipment and method of manufacture thereof

LAM RES CORP8 citations84
US6852636B1Feb 8, 2005

Insitu post etch process to remove remaining photoresist and residual sidewall passivation

LAM RES CORP14 citations84
US6475298B1Nov 5, 2002

Post-metal etch treatment to prevent corrosion

LAM RES CORP14 citations82
US6790242B2Sep 14, 2004

Fullerene coated component of semiconductor processing equipment and method of manufacturing thereof

LAM RES CORP11 citations74
US7503977B1Mar 17, 2009

Solidifying layer for wafer cleaning

LAM RES CORP6 citations63
US7128804B2Oct 31, 2006

Corrosion resistant component of semiconductor processing equipment and method of manufacture thereof

LAM RES CORP1 citations63
US6242107B1Jun 5, 2001

Methods for etching an aluminum-containing layer

LAM RES CORP3 citations63
US7270760B2Sep 18, 2007

Method and apparatus for simulating standard test wafers

LAM RES CORP0 citations50
US6296778B1Oct 2, 2001

Method and apparatus for simulating standard test wafers

LAM RES CORP1 citations50

O'DONNELL ROBERT J

3 patents

DONNELL ROBERT J O

1 patent