Inventor
DAUGHERTY JOHN E
US27 patents
⚠️ This page may combine multiple inventors who share the name “DAUGHERTY JOHN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
24 patentsUS7300537B2Nov 27, 2007
Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor
LAM RES CORP64 citations98
US6537429B2Mar 25, 2003
Diamond coatings on reactor wall and method of manufacturing thereof
LAM RES CORP110 citations98
US6344105B1Feb 5, 2002
Techniques for improving etch rate uniformity
LAM RES CORP141 citations97
US7311797B2Dec 25, 2007
Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor
LAM RES CORP50 citations96
US6830622B2Dec 14, 2004
Cerium oxide containing ceramic components and coatings in semiconductor processing equipment and methods of manufacture thereof
LAM RES CORP63 citations96
US6620520B2Sep 16, 2003
Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof
LAM RES CORP54 citations96
US6613442B2Sep 2, 2003
Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof
LAM RES CORP49 citations96
US6533910B2Mar 18, 2003
Carbonitride coated component of semiconductor processing equipment and method of manufacturing thereof
LAM RES CORP62 citations96
US7255898B2Aug 14, 2007
Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof
LAM RES CORP29 citations92
US7250114B2Jul 31, 2007
Methods of finishing quartz glass surfaces and components made by the methods
LAM RES CORP36 citations92
US6994769B2Feb 7, 2006
In-situ cleaning of a polymer coated plasma processing chamber
LAM RES CORP25 citations92
US6776851B1Aug 17, 2004
In-situ cleaning of a polymer coated plasma processing chamber
LAM RES CORP49 citations92
US6773751B2Aug 10, 2004
Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof
LAM RES CORP26 citations92
US7605086B2Oct 20, 2009
Corrosion resistant component of semiconductor processing equipment and method of manufacture thereof
LAM RES CORP8 citations84
US7402258B2Jul 22, 2008
Methods of removing metal contaminants from a component for a plasma processing apparatus
LAM RES CORP11 citations84
US7685965B1Mar 30, 2010
Apparatus for shielding process chamber port
LAM RES CORP17 citations82
US7578889B2Aug 25, 2009
Methodology for cleaning of surface metal contamination from electrode assemblies
LAM RES CORP9 citations82
US9314854B2Apr 19, 2016
Ductile mode drilling methods for brittle components of plasma processing apparatuses
LAM RES CORP10 citations77
US6790242B2Sep 14, 2004
Fullerene coated component of semiconductor processing equipment and method of manufacturing thereof
LAM RES CORP11 citations74
US11393705B2Jul 19, 2022
Wafer transport assembly with integrated buffers
LAM RES CORP2 citations71
US10557197B2Feb 11, 2020
Monolithic gas distribution manifold and various construction techniques and use cases therefor
LAM RES CORP4 citations71
US7128804B2Oct 31, 2006
Corrosion resistant component of semiconductor processing equipment and method of manufacture thereof
LAM RES CORP1 citations63
US11662237B2May 30, 2023
MEMS coriolis gas flow controller
LAM RES CORP0 citations62
US11087961B2Aug 10, 2021
Quartz component with protective coating
LAM RES CORP0 citations58