Inventor

OTANI HIROYUKI

JP23 patents

⚠️ This page may combine multiple inventors who share the name “OTANI HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OTANI HIROYUKI

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Electronic parts mounting method and device therefor

Method of forming a ball bond using a bonding capillary

Method for mounting semiconductor element to circuit board

Method and apparatus for mounting component

Component mounting method and apparatus

Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon

Screen printing method and printing apparatus

Electronic parts packaging method and electronic parts package

Method for mounting a semiconductor element to an interposer by compression bonding

Semiconductor element having protruded bump electrodes

Semiconductor element having protruded bump electrodes

Method and device for sealing IC chip

Bump bonding device and bump bonding method

Multilayered circuit board forming method and multilayered circuit board

Method for assembling integral type electronic component and integral type electronic component

Method for mounting a semiconductor chip to a semiconductor chip-mounting board

Printing method and printing apparatus

Semiconductor chip—mounting board

Bump bonding device and bump bonding method

PANASONIC CORP

Electronic component unit

Electronic component mounting method and apparatus

NEC CORP

Storage device, control method for partitioning logical memory devices, and medium embodying program for partitioning logical memory devices

WATANABE TETSUYA

Process for producing polyurethane elastomer foams