Inventor

HUANG CHEN-DER

TW2 patents

⚠️ This page may combine multiple inventors who share the name “HUANG CHEN-DER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

1 patent

US7105920B2Sep 12, 2006

Substrate design to improve chip package reliability

TAIWAN SEMICONDUCTOR MFG23 citations91

VANGUARD INT SEMICONDUCT CORP

1 patent

US6323541B1Nov 27, 2001

Structure for manufacturing a semiconductor die with copper plated tapes

VANGUARD INT SEMICONDUCT CORP7 citations68