Inventor · disambiguated record
Hajime Akahori
Also filed as: AKAHORI HAJIME
1 granted patent·2 pending applications·1 citations·filing 2006–2021
16Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0153US8052505B2Wafer processing method for processing wafer having bumps formed thereonTOKYO SEIMITSU CO LTD·Filed 2009·Granted Nov 8, 2011·1 cites·4 claims
- 0234US2024181589A1Processing systemTOKYO SEIMITSU CO LTD·Filed 2021·Application pending·0 cites
- 0320US2007125900A1Tape holding deviceAKAHORI HAJIME·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →