P

Inventor

YE YAN

US512 patents
⚠️ This page may combine multiple inventors who share the name “YE YAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

34 patents
US6894245B2May 17, 2005

Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression

APPLIED MATERIALS INC108 citations99
US6312554B1Nov 6, 2001

Apparatus and method for controlling the ratio of reactive to non-reactive ions in a semiconductor wafer processing chamber

APPLIED MATERIALS INC206 citations99
US5710486AJan 20, 1998

Inductively and multi-capacitively coupled plasma reactor

APPLIED MATERIALS INC139 citations99
US8012794B2Sep 6, 2011

Capping layers for metal oxynitride TFTS

APPLIED MATERIALS INC51 citations98
US7955986B2Jun 7, 2011

Capacitively coupled plasma reactor with magnetic plasma control

APPLIED MATERIALS INC70 citations98
US7220937B2May 22, 2007

Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination

APPLIED MATERIALS INC94 citations98
US7030335B2Apr 18, 2006

Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression

APPLIED MATERIALS INC72 citations98
US6939434B2Sep 6, 2005

Externally excited torroidal plasma source with magnetic control of ion distribution

APPLIED MATERIALS INC72 citations98
US6586886B1Jul 1, 2003

Gas distribution plate electrode for a plasma reactor

APPLIED MATERIALS INC115 citations98
US6551446B1Apr 22, 2003

Externally excited torroidal plasma source with a gas distribution plate

APPLIED MATERIALS INC96 citations98
US6410449B1Jun 25, 2002

Method of processing a workpiece using an externally excited torroidal plasma source

APPLIED MATERIALS INC88 citations98
US6348126B1Feb 19, 2002

Externally excited torroidal plasma source

APPLIED MATERIALS INC121 citations98
US6331380B1Dec 18, 2001

Method of pattern etching a low K dielectric layer

APPLIED MATERIALS INC159 citations98
US6143476ANov 7, 2000

Method for high temperature etching of patterned layers using an organic mask stack

APPLIED MATERIALS INC186 citations98
US6080529AJun 27, 2000

Method of etching patterned layers useful as masking during subsequent etching or for damascene structures

APPLIED MATERIALS INC551 citations98
US5968847AOct 19, 1999

Process for copper etch back

APPLIED MATERIALS INC94 citations98
US5879575AMar 9, 1999

Self-cleaning plasma processing reactor

APPLIED MATERIALS INC97 citations98
US5756400AMay 26, 1998

Method and apparatus for cleaning by-products from plasma chamber surfaces

APPLIED MATERIALS INC407 citations98
US6547977B1Apr 15, 2003

Method for etching low k dielectrics

APPLIED MATERIALS INC320 citations97
US6458516B1Oct 1, 2002

Method of etching dielectric layers using a removable hardmask

APPLIED MATERIALS INC113 citations97
US6352081B1Mar 5, 2002

Method of cleaning a semiconductor device processing chamber after a copper etch process

APPLIED MATERIALS INC252 citations97
US5900062AMay 4, 1999

Lift pin for dechucking substrates

APPLIED MATERIALS INC102 citations97
US7927713B2Apr 19, 2011

Thin film semiconductor material produced through reactive sputtering of zinc target using nitrogen gases

APPLIED MATERIALS INC30 citations96
US7132618B2Nov 7, 2006

MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression

APPLIED MATERIALS INC43 citations96
US6494986B1Dec 17, 2002

Externally excited multiple torroidal plasma source

APPLIED MATERIALS INC65 citations96
US6468388B1Oct 22, 2002

Reactor chamber for an externally excited torroidal plasma source with a gas distribution plate

APPLIED MATERIALS INC66 citations96
US6453842B1Sep 24, 2002

Externally excited torroidal plasma source using a gas distribution plate

APPLIED MATERIALS INC62 citations96
US6352049B1Mar 5, 2002

Plasma assisted processing chamber with separate control of species density

APPLIED MATERIALS INC498 citations96
US6020686AFeb 1, 2000

Inductively and multi-capacitively coupled plasma reactor

APPLIED MATERIALS INC52 citations96
US5891348AApr 6, 1999

Process gas focusing apparatus and method

APPLIED MATERIALS INC61 citations96
US5817534AOct 6, 1998

RF plasma reactor with cleaning electrode for cleaning during processing of semiconductor wafers

APPLIED MATERIALS INC94 citations96
US5486235AJan 23, 1996

Plasma dry cleaning of semiconductor processing chambers

APPLIED MATERIALS INC74 citations96
US7221553B2May 22, 2007

Substrate support having heat transfer system

APPLIED MATERIALS INC49 citations95
US6372633B1Apr 16, 2002

Method and apparatus for forming metal interconnects

APPLIED MATERIALS INC58 citations95

VID SCALE INC

9 patents

YE YAN

3 patents

CHEN PEISONG

2 patents

(unassigned)

1 patent

BAO YILIANG

1 patent

Showing the top 50 of 512 patents by PatentIndex Score.