Inventor · disambiguated record

Mitsuru Ohida

Also filed as: OHIDA MITSURU

1 granted patent·85 citations·filing 1996–1996

52Inventor score

Technology areasH10W

Files withTOSHIBA KK1

Top patents by PatentIndex Score

1 record

0182US5786271AProduction of semiconductor package having semiconductor chip mounted with its face down on substrate with protruded electrodes therebetween and semiconductor packageTOSHIBA KK·Filed 1996·Granted Jul 28, 1998·85 cites·3 claims

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