Inventor
ZHONG CHIA-WEN
TW8 patents
Patents
8 patentsUS12424579B2Sep 23, 2025
Integrated chip including an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12417946B2Sep 16, 2025
Film scheme to reduce plasma-induced damage
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12369329B2Jul 22, 2025
Bottom-electrode interface structure for memory
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11973050B2Apr 30, 2024
Method for forming an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11792996B2Oct 17, 2023
Bottom-electrode interface structure for memory
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12557566B2Feb 17, 2026
Semiconductor device having a switching layer including a compound having aluminum, oxygen, and nitrogen and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations54
US12211737B2Jan 28, 2025
Cleaning chamber for metal oxide removal
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12550633B2Feb 10, 2026
Diffusion barrier to mitigate direct-shortage leakage in conductive bridging ram (CBRAM)
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50