Inventor

LIN YEN-LIANG

TW110 patents

⚠️ This page may combine multiple inventors who share the name “LIN YEN-LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN YEN-LIANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor packages and methods of forming the same

Semiconductor structure and method of fabricating the same

CMOS image sensor having indented photodiode structure

Semiconductor structure and method for forming the same

Wide channel gate structure and method of forming

Method of manufacturing a semiconductor structure

Semiconductor structure and manufacturing method thereof

Conductive contacts having varying widths and method of manufacturing same

Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices

Method of forming bump structure having a side recess and semiconductor structure including the same

Image sensor device

Wide channel semiconductor device

Semiconductor packages and methods of forming the same

Semiconductor structure and method of fabricating the same

Method of forming image sensor device

Semiconductor package and method

Single photon avalanche diode

CMOS image sensor having indented photodiode structure

Semiconductor package and manufacturing method thereof

Semiconductor packages and methods of forming the same

Integrated circuit package and method

Image sensor device and method of forming the same

Bump structure having a side recess and semiconductor structure including the same

Semiconductor package and method

Semiconductor structure

Single photon avalanche diode

Scheme for connector site spacing and resulting structures

Bump structure having a side recess and semiconductor structure including the same

Semiconductor device having conductive bumps of varying heights

Bump-on-trace interconnection structure for flip-chip packages

Semiconductor device having conductive bumps of varying heights

Methods and apparatus for bump-on-trace chip packaging

Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof

Integrated circuit package and method

Semiconductor structure

Semiconductor structure

Semiconductor device with reduced leakage current and fabricating method thereof

Semiconductor processing tool and methods of operation

Semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

Conductive contacts having varying widths and method of manufacturing same

Scheme for connector site spacing and resulting structures

Bump structure having a single side recess

Bump structure having a side recess and semiconductor structure including the same

GEN ELECTRIC

Visual anomaly detection system

Building footprint generation by using clean mask generation and received image data

Equipment damage prediction system using neural networks

CHANG CHIH-HORNG

Bump structures

AMAZON TECH INC

Complementary consumer item selection

LIN YEN-LIANG

Elongated bumps in integrated circuit devices

IND TECH RES INST

System and method for monitoring particles in solution