Inventor · disambiguated record

Jason Pittam

Also filed as: PITTAM JASON

1 granted patent·10 citations·filing 2001–2001

32Inventor score

Technology areasH10W

Files withMICRON TECHNOLOGY INC1

Top patents by PatentIndex Score

1 record

0155US6781248B2Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packagedMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 24, 2004·10 cites·113 claims

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