Inventor
MATSUSHIMA TOSHIFUMI
JP16 patents
⚠️ This page may combine multiple inventors who share the name “MATSUSHIMA TOSHIFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUI MINING & SMELTING CO
8 patentsUS6693793B2Feb 17, 2004
Double-sided copper clad laminate for capacitor layer formation and its manufacturing method
MITSUI MINING & SMELTING CO50 citations95
US6905757B2Jun 14, 2005
Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminate
MITSUI MINING & SMELTING CO15 citations81
US6831129B2Dec 14, 2004
Resin-coated copper foil, and printed wiring board using resin-coated copper foil
MITSUI MINING & SMELTING CO3 citations62
US10342143B2Jul 2, 2019
Production method for printed wiring board having dielectric layer
MITSUI MINING & SMELTING CO0 citations52
US10524360B2Dec 31, 2019
Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board
MITSUI MINING & SMELTING CO0 citations50
US9924597B2Mar 20, 2018
Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board
MITSUI MINING & SMELTING CO0 citations50
US10863621B2Dec 8, 2020
Metal foil with releasing resin layer, and printed wiring board
MITSUI MINING & SMELTING CO0 citations48
US10244640B2Mar 26, 2019
Copper clad laminate provided with protective layer and multilayered printed wiring board
MITSUI MINING & SMELTING CO0 citations39
MITSUI MINING & SMELTING CO LTD
5 patentsUS11419210B2Aug 16, 2022
Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
MITSUI MINING & SMELTING CO LTD0 citations62
US11166383B2Nov 2, 2021
Resin-clad copper foil, copper-clad laminated plate, and printed wiring board
MITSUI MINING & SMELTING CO LTD1 citations61
US11950376B2Apr 2, 2024
Copper-clad laminate
MITSUI MINING & SMELTING CO LTD0 citations50
US12297354B2May 13, 2025
Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor
MITSUI MINING & SMELTING CO LTD0 citations48
US11310910B2Apr 19, 2022
Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor
MITSUI MINING & SMELTING CO LTD0 citations48