Inventor · disambiguated record

Toshiharu Egami

Also filed as: EGAMI TOSHIHARU

1 granted patent·14 citations·filing 2000–2000

36Inventor score

Technology areasH10W

Files withFUJITSU LTD1

Top patents by PatentIndex Score

1 record

0163US6522016B1Interconnection structure with film to increase adhesion of the bumpFUJITSU LTD·Filed 2000·Granted Feb 18, 2003·14 cites·7 claims

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