Inventor

LAI CHIH-HSIN

TW2 patents

⚠️ This page may combine multiple inventors who share the name “LAI CHIH-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHAN CHANG-YUEH

1 patent

US8618641B2Dec 31, 2013

Leadframe-based semiconductor package

CHAN CHANG-YUEH6 citations79

SILICONWARE PRECISION INDUSTRIES CO LTD

1 patent

US9130064B2Sep 8, 2015

Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48