Inventor
CHAUDHRY IMTIAZ
US3 patents
Patents
3 patentsUS6887741B2May 3, 2005
Method for making an enhanced die-up ball grid array package with two substrates
BROADCOM CORP37 citations95
US6876553B2Apr 5, 2005
Enhanced die-up ball grid array package with two substrates
BROADCOM CORP52 citations95
US7312108B2Dec 25, 2007
Method for assembling a ball grid array package with two substrates
BROADCOM CORP25 citations91