Inventor
CAPARAS JOSE ALVIN
SG33 patents
⚠️ This page may combine multiple inventors who share the name “CAPARAS JOSE ALVIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
11 patentsUS8035207B2Oct 11, 2011
Stackable integrated circuit package system with recess
STATS CHIPPAC LTD23 citations93
US7443015B2Oct 28, 2008
Integrated circuit package system with downset lead
STATS CHIPPAC LTD28 citations92
US7977782B2Jul 12, 2011
Integrated circuit package system with dual connectivity
STATS CHIPPAC LTD7 citations84
US9607965B2Mar 28, 2017
Semiconductor device and method of controlling warpage in reconstituted wafer
STATS CHIPPAC LTD6 citations83
US7479409B2Jan 20, 2009
Integrated circuit package with elevated edge leadframe
STATS CHIPPAC LTD6 citations74
US7449369B2Nov 11, 2008
Integrated circuit package system with multiple molding
STATS CHIPPAC LTD6 citations74
US7998790B2Aug 16, 2011
Integrated circuit packaging system with isolated pads and method of manufacture thereof
STATS CHIPPAC LTD2 citations63
US7919360B1Apr 5, 2011
Integrated circuit packaging system with circuitry stacking and method of manufacture thereof
STATS CHIPPAC LTD6 citations63
US9281259B2Mar 8, 2016
Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP
STATS CHIPPAC LTD2 citations62
US7871863B2Jan 18, 2011
Integrated circuit package system with multiple molding
STATS CHIPPAC LTD0 citations52
US7482683B2Jan 27, 2009
Integrated circuit encapsulation system with vent
STATS CHIPPAC LTD0 citations48
CAMACHO ZIGMUND RAMIREZ
6 patentsUS8698294B2Apr 15, 2014
Integrated circuit package system including wide flange leadframe
CAMACHO ZIGMUND RAMIREZ2 citations63
US8258609B2Sep 4, 2012
Integrated circuit package system with lead support
CAMACHO ZIGMUND RAMIREZ2 citations63
US9076737B2Jul 7, 2015
Integrated circuit packaging system with bumps and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ0 citations52
US8389332B2Mar 5, 2013
Integrated circuit packaging system with isolated pads and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ0 citations52
US8252634B2Aug 28, 2012
Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ0 citations52
US8664038B2Mar 4, 2014
Integrated circuit packaging system with stacked paddle and method of manufacture thereof
CAMACHO ZIGMUND RAMIREZ0 citations42
ST ASSEMBLY TEST SERVICES LTD
5 patentsUS8035204B2Oct 11, 2011
Large die package structures and fabrication method therefor
ST ASSEMBLY TEST SERVICES LTD13 citations92
US7700404B2Apr 20, 2010
Large die package structures and fabrication method therefor
ST ASSEMBLY TEST SERVICES LTD16 citations92
US7129569B2Oct 31, 2006
Large die package structures and fabrication method therefor
ST ASSEMBLY TEST SERVICES LTD28 citations92
US7060536B2Jun 13, 2006
Dual row leadframe and fabrication method
ST ASSEMBLY TEST SERVICES LTD26 citations92
US7339258B2Mar 4, 2008
Dual row leadframe and fabrication method
ST ASSEMBLY TEST SERVICES LTD11 citations84
LIN YAOJIAN
3 patentsUS8648470B2Feb 11, 2014
Semiconductor device and method of forming FO-WLCSP with multiple encapsulants
LIN YAOJIAN12 citations84
US8610286B2Dec 17, 2013
Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in Fo-WLCSP
LIN YAOJIAN5 citations83
US9059157B2Jun 16, 2015
Integrated circuit packaging system with substrate and method of manufacture thereof
LIN YAOJIAN0 citations51
BATHAN HENRY DESCALZO
3 patentsUS8273602B2Sep 25, 2012
Integrated circuit package system with integration port
BATHAN HENRY DESCALZO9 citations84
US8569872B2Oct 29, 2013
Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation
BATHAN HENRY DESCALZO0 citations52
US8207600B2Jun 26, 2012
Integrated circuit package system with encapsulating features
BATHAN HENRY DESCALZO1 citations49